Kabushiki kaisha toshiba (20240312947). SEMICONDUCTOR DEVICE simplified abstract
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Tomohiro Iguchi of Himeji Hyogo (JP)
Tatsuya Hirakawa of Takasago Hyogo (JP)
Shogo Minami of Yokohama Kanagawa (JP)
Hiroyuki Matsuo of Nerima Tokyo (JP)
Izuru Komatsu of Yokohama Kanagawa (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240312947 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes an insulating substrate with metal layers, a semiconductor chip with electrodes, a bonding wire, and resin layers of varying properties.
- The device features a semiconductor chip connected to metal layers via electrodes and a bonding wire.
- The bonding wire is connected to the upper electrode of the semiconductor chip and the second metal layer.
- The resin layers cover the semiconductor chip and bonding wire, with different resins offering varying properties such as Young's modulus and moisture permeability.
Potential Applications: - This technology can be used in various electronic devices such as integrated circuits, sensors, and microprocessors. - It can also be applied in automotive electronics, telecommunications, and consumer electronics.
Problems Solved: - Provides a reliable connection between the semiconductor chip and metal layers. - Offers protection to the semiconductor chip and bonding wire from external elements.
Benefits: - Enhanced durability and reliability of semiconductor devices. - Improved performance and longevity of electronic components.
Commercial Applications: - The technology can be utilized by semiconductor manufacturers to enhance the quality and longevity of their products. - It can also benefit companies in the electronics industry looking to improve the reliability of their devices.
Questions about the Technology: 1. How does the use of different resin layers with varying properties impact the overall performance of the semiconductor device? 2. What are the specific challenges in the semiconductor industry that this technology aims to address?
Frequently Updated Research: - Stay updated on advancements in semiconductor materials and bonding technologies to further enhance the performance of semiconductor devices.
Original Abstract Submitted
a semiconductor device according to an embodiment includes: an insulating substrate having a first metal layer and a second metal layer; a semiconductor chip on the first metal layer having an upper electrode and a lower electrode connected to the first metal layer; a bonding wire having a first end portion connected to the upper electrode and a second end portion connected to the second metal layer; a first resin layer covering the semiconductor chip and the bonding wire, the first resin layer containing a first resin; a second resin layer covering a bonding portion between the first end portion and the upper electrode containing a second resin having a young's modulus higher than that of the first resin; a third resin layer on the first resin layer, the third resin layer containing a third resin having a moisture permeability lower than that of the first resin.
