KABUSHIKI KAISHA TOSHIBA patent applications on March 6th, 2025
Patent Applications by KABUSHIKI KAISHA TOSHIBA on March 6th, 2025
KABUSHIKI KAISHA TOSHIBA: 36 patent applications
KABUSHIKI KAISHA TOSHIBA has applied for patents in the areas of H01L29/06 (4), H01L29/739 (3), H01L29/40 (2), H01L29/04 (2), H01L23/00 (2) G01C19/5712 (2), B23K35/025 (1), H03K3/38 (1), H01L21/78 (1), H01L23/367 (1)
With keywords such as: portion, region, fixed, semiconductor, electrode, third, data, annular, face, and embodiment in patent application abstracts.
Patent Applications by KABUSHIKI KAISHA TOSHIBA
Inventor(s): Shota YAMAMOTO of Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): B23K35/02, B22F1/103, B23K1/00, B23K35/30, B23K101/42, B23K103/18, H01L21/48, H01L23/00, H01L23/373
CPC Code(s): B23K35/025
Abstract: a method for producing an active metal paste according to an embodiment includes a premixing process and a kneading process. the premixing process includes producing a mixture by mixing a binder with a metal powder; the metal powder includes copper and an active metal; the binder includes a resin dissolved in an organic solvent; and the mixture includes 60 to 95 mass % of the metal powder. the kneading process includes producing an active metal paste by causing the mixture to rotate and revolve.
Inventor(s): Shoya SANO of Yokohama (JP) for kabushiki kaisha toshiba, Kai FUNAKI of Yokohama (JP) for kabushiki kaisha toshiba, Hideki SATO of Yokohama (JP) for kabushiki kaisha toshiba
IPC Code(s): C04B35/584, B24B1/00
CPC Code(s): C04B35/584
Abstract: a ceramic ball material according to an embodiment includes a spherical portion; and a band-shaped portion formed over a circumference of a surface of the spherical portion. the ceramic ball material has a ratio r1/r2 of 0.3 or more and less than 1.0, where r1 denotes a surface roughness of an end portion of the band-shaped portion; and r2 denotes a surface roughness of a center portion of the band-shaped portion.
Inventor(s): Taishi FUKAZAWA of Chofu Tokyo (JP) for kabushiki kaisha toshiba, Yoshihiko NAKANO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Norihiro YOSHINAGA of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): C25B11/091, C25B9/77, C25B11/031, C25B13/02
CPC Code(s): C25B11/091
Abstract: an electrode according to an embodiment including a support and a catalyst layer provided on the support and alternately stacked with sheet layers and gap layers. the catalyst layer is for electrolysis. the catalyst layer comprises a first metal which is one or more elements selected from the group consisting of ir, ru, pt, pd, hf, v, au, ta, w, nb, zr, mo, and cr, and a second metal which is one or more elements selected from the group consisting of ni, co, mn, fe, cu, al, and zn. the catalyst layer comprises a first region and a second region. the first metal in the first region is more oxidized than the first metal in the second region. a ratio of the second metal in the first region is greater than the ratio of the second metal in the second region.
Inventor(s): Kenzo ISOGAWA of Tokyo (JP) for kabushiki kaisha toshiba, Toshiyuki ONO of Kawasaki (JP) for kabushiki kaisha toshiba
IPC Code(s): E21B47/002, E21B47/085
CPC Code(s): E21B47/0025
Abstract: according to one embodiment, a wall detection device includes an acquirer and processing circuitry. the acquirer acquires a point cloud, which includes a series of coordinates of a plurality of points corresponding to a first wall and a second wall that oppose each other. the processing circuitry detects a first detected wall and a second detected wall based on a model and the acquired point cloud, the model representing a first plane which corresponds to the first detected wall and indicates a surface of the first wall and a second plane which corresponds to the second detected wall and indicates a surface of the second wall, and the model representing the first plane and the second plane being parallel to each other.
Inventor(s): Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01C19/5677
CPC Code(s): G01C19/5677
Abstract: according to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, and a movable portion supported by the fixed portion. the movable portion includes a plurality of annular portions, a plurality of connect portions, and a first radial structure. each of the plurality of annular portions is provided around the fixed portion with the fixed portion as a center in a first plane along the first face. the plurality of connect portion extend along a radial direction. one of the plurality of connect portions connects two of the plurality of annular portions to each other. the plurality of annular portions include a first annular portion and a second annular portion. the first radial structure is connected to the first annular portion. the first radial structure extends toward the second annular portion along a first radial direction.
Inventor(s): Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Etsuji OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Fumitaka ISHIBASHI of Sumida Tokyo (JP) for kabushiki kaisha toshiba, Jumpei OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01C19/5705
CPC Code(s): G01C19/5705
Abstract: according to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, a movable portion supported by the fixed portion, a first fixed electrode, and a first opposing fixed electrode. the fixed portion includes a first center in a first plane parallel to the first face. the movable portion includes first and second annular portions. the first fixed electrode includes first and second regions. the first opposing fixed electrode includes first and second opposing regions. the first region is provided between the second annular portion and the first annular portion. the first opposing region is provided between the second annular portion and the first region. the second region is provided between the second annular portion and the first annular portion. the second opposing region is provided between the second annular portion and the second region.
Inventor(s): Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Etsuji OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Jumpei OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Fumitaka ISHIBASHI of Sumida Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G01C19/5712
CPC Code(s): G01C19/5712
Abstract: according to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, and a movable portion supported by the fixed portion. the movable portion includes a plurality of annular portions and a plurality of connect portions. each of the plurality of annular portions is provided around the fixed portion with the fixed portion as a center on a first plane along the first face. the plurality of annular portions includes a first annular portion, a second annular portion, and a third annular portion. the plurality of connect portions includes first and second connect portions. the first connect portion is provided between the first and second annular portions, and is connected to the first and second annular portions. the second connect portion is provided between the second and third annular portions, and is connected to the second and third annular portions.
Inventor(s): Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01C19/5712
CPC Code(s): G01C19/5712
Abstract: according to one embodiment, a sensor includes a base including a first face, a fixed portion fixed to the first face, and a movable portion supported by the fixed portion. the movable portion includes a plurality of annular portions, a plurality of connect portions, and a first structure. each of the plurality of annular portions is provided around the fixed portion with the fixed portion as a center in a first plane along the first face. one of the plurality of connect portions connects two of the plurality of annular portions to each other. the plurality of annular portions include a first annular portion. the first annular portion is outermost of the plurality of annular portions. the first structure is connected to the first annular portion. the first annular portion is provided between the fixed portion and the first structure.
Inventor(s): Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Etsuji OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Jumpei OGAWA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Fumitaka ISHIBASHI of Sumida Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G01C19/5783
CPC Code(s): G01C19/5783
Abstract: according to one embodiment, a sensor includes a first member, a first substrate, and a sensor section. a direction from the first member to the first substrate is along a first direction. a first member thickness of the first member is thicker than a first substrate thickness of the first substrate along the first direction. the sensor section is provided between the first member and the first substrate, and is fixed to the first member. the substrate is fixed to the sensor section. the sensor section includes a housing and a sensor element provided in the housing. the sensor element includes a sensor base, a fixed portion fixed to the sensor base, and a movable portion supported by the fixed portion. a direction from the fixed portion to the sensor base is along the first direction. a first gap is provided between the sensor base and the movable portion.
Inventor(s): Yasushi TOMIZAWA of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Hideaki MURASE of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Fumito MIYAZAKI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Daiki ONO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kei MASUNISHI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Kengo UCHIDA of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01D11/24, G01D11/30
CPC Code(s): G01D11/245
Abstract: according to one embodiment, a sensor includes a base including a first face, an inner structure fixed to the first face, a fixed portion fixed to the first face, a movable portion supported by the fixed portion, a plurality of fixed electrodes fixed to the first face, and a plurality of connect members. a first gap is provided between the first face and the movable portion. the movable portion includes a first annular portion and a first connect portion. the plurality of fixed electrodes include a first fixed electrode and a first opposing fixed electrode that face the first annular portion. the inner structure includes a first conductive portion. the first conductive portion includes a first region and a first opposing region. the plurality of connect members include a first connect member and a first opposing connect member.
20250076211. JUDGMENT APPARATUS_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Tomoyuki YAHAGI of Nerima Tokyo (JP) for kabushiki kaisha toshiba, Nobuyuki MATSUMOTO of Inagi Tokyo (JP) for kabushiki kaisha toshiba, Kazutoshi NAGANO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01N21/88, G01N21/93, G06T7/00, G06V10/60
CPC Code(s): G01N21/8851
Abstract: to provide a judgment apparatus capable of achieving improved judgment accuracy, a judgment apparatus according to an embodiment judges a judgment target as pass or fail based on pass judgment characteristic information produced using characteristic amounts extracted from previously collected monitoring data items of judgment targets judged as pass. the pass/fail judgment processing includes extracting the characteristic amounts from monitoring data items of judgment targets sequentially input and successively performing pass/fail judgment of the judgment targets based on the pass judgment characteristic information. when one of the judgment targets is judged as pass in the successive pass/fail judgment, the characteristic amount of the judgment target judged as pass is used to update the pass judgment characteristic information. pass/fail judgment of a judgment target subsequent to the judgment target judged as pass is performed based on the updated pass judgment characteristic information.
20250076238. SENSOR AND SENSOR SYSTEM_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Yosuke AKIMOTO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Akira FUJIMOTO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Yoshihiko KURUI of Chigasaki Kanagawa (JP) for kabushiki kaisha toshiba, Ping WANG of Fujisawa Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G01N27/18, G01N27/04
CPC Code(s): G01N27/18
Abstract: according to one embodiment, a sensor includes an element section. the element section includes a base including a first region, a second region and a third region, a first element fixed to the first region, a second element fixed to the second region, and a third element fixed to the third region. the first element includes a first fixed portion fixed to the first region, and a first film portion supported by the first fixed portion. the first film portion includes a first resistance member and a first layer including a first material. the second element includes a second fixed portion fixed to the second region, and a second film portion supported by the second fixed portion. the third element includes a third fixed portion fixed to the third region, and a third film portion supported by the third fixed portion.
Inventor(s): Kazunori MATSUYAMA of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0655
Abstract: according to one embodiment, there is provided a disk device including a disk medium, a memory and a controller. on the disk medium, data is recorded according to an address. the controller generates or updates a database and stores the database in the memory as a command including the address is received. the database is associated with address ranges of commands, and includes a tree-like array in accordance with command addresses and time series. the controller manages commands using the database.
Inventor(s): Akihiro YAMAGUCHI of Kita Tokyo (JP) for kabushiki kaisha toshiba, Ken UENO of Tachikawa Tokyo (JP) for kabushiki kaisha toshiba, Ryusei SHINGAKI of Setagaya Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G06F8/65, G06F11/34
CPC Code(s): G06F8/65
Abstract: an information processing device according to one embodiment includes one or more hardware processors. the hardware processors executes update processing on a designated number of first sections on the basis of a first estimation result and a second estimation result. the first estimation result is obtained by inputting first time-series data to an estimation model. the second estimation result is obtained by inputting second time-series data to the estimation model. the second time-series data is obtained by applying mask processing to partial time-series data of a second section in the first time-series data. the second section is other than the designated number of the first sections.
Inventor(s): Shigeru MAYA of Edogawa Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G06F16/901, G06F16/28, G06Q30/0601
CPC Code(s): G06F16/9024
Abstract: an information processing apparatus includes a processing unit the processing unit calculates, for each pair of pieces of data defined in a graph representing relational data a indicating a relationship between a plurality of pieces of data in a graph structure, a degree of relevance between a target category to be analyzed and another category other than the target category on the basis of a score calculated according to a degree of relationship between a pair of pieces of data constituting the pair and an evaluation index for evaluating the degree of relevance between the categories.
Inventor(s): Hiro GANGI of Tokyo (JP) for kabushiki kaisha toshiba, Yasunori TAGUCHI of Kawasaki (JP) for kabushiki kaisha toshiba, Tomoaki INOKUCHI of Yokohama (JP) for kabushiki kaisha toshiba, Yusuke KOBAYASHI of Yokohama (JP) for kabushiki kaisha toshiba, Taichi FUKUDA of Yokohama (JP) for kabushiki kaisha toshiba
IPC Code(s): G06F30/12
CPC Code(s): G06F30/12
Abstract: a parameter optimization device includes a processing device configured to: generate a partial search space of a second dimensionality from a search space of a first dimensionality, the second dimensionality being less than the first dimensionality; select a plurality of search points in the partial search space by correcting an acquisition function with a local penalty function; and observe, in parallel, a plurality of objective functions corresponding respectively to the plurality of search points.
Inventor(s): Keita Takahashi of Fuchu Tokyo (JP) for kabushiki kaisha toshiba, Hidetaka Ohira of Tokyo (JP) for kabushiki kaisha toshiba, Yukako Nakagawa of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G06N20/00
CPC Code(s): G06N20/00
Abstract: according to one embodiment, an information processing apparatus includes a processor. the processor acquires quantitative information relating to a machine learning model. the processor acquires user input information input from a user. the processor selects, based on the quantitative information and the user input information, an item to be displayed and a visualizing method from display information definitions that include items relating to 10 evaluation of the machine learning model and visualizing methods of the evaluation. the processor generates, based on the selected result, display information that includes at least partial content of the quantitative information and the user input information.
Inventor(s): Kentaro TAKAGI of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Toshiyuki OSHIMA of Tokyo (JP) for kabushiki kaisha toshiba, Kouta NAKATA of Chigasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G06T7/00
CPC Code(s): G06T7/001
Abstract: according to one embodiment, a defect classification support apparatus includes a processor. the processor acquires a defect image of an outer appearance of a target object having a defect. the processor extracts a defect patch image from the defect image, the defect patch image being a partial image that includes the defect. the processor extracts a normal patch image from the defect image, the normal patch image being a partial image free of the defect. the processor computes a feature amount of the defect based on the defect patch image and the normal patch image.
Inventor(s): Shun HIRAO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Shuhei NITTA of Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G06V10/762, G06V10/44
CPC Code(s): G06V10/762
Abstract: according to one embodiment, a training apparatus includes processing circuitry. the processing circuitry acquires a plurality of items of subject data and a target cluster number, iteratively trains a learning model on the plurality of items of subject data by unsupervised learning based on learning conditions, estimates a feature cluster number based on a plurality of feature vectors corresponding to the plurality of items of subject data, and updates the learning conditions based on the feature cluster number and the target cluster number.
Inventor(s): Shun HIRAO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Shuhei NITTA of Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): G06V10/774, G06V10/26, G06V10/82, G06V10/94, G06V10/98, G06V20/69
CPC Code(s): G06V10/774
Abstract: according to one embodiment, a training apparatus includes processing circuitry. the processing circuitry acquires a plurality of items of subject data and a plurality of items of incidental data corresponding to the plurality of items of subject data, calculates an importance of each of the plurality of items of subject data based on a distribution of the plurality of items of incidental data, determines, for each of the plurality of items of subject data, a number of items of training data according to the importance, and generate a plurality of items of training data corresponding to the determined number of items of training data, and iteratively trains a learning model on the plurality of items of training data for each of the plurality of items of subject data by unsupervised learning.
20250078866. SUSPENSION ASSEMBLY AND DISK DRIVE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Shinra Yamanaka of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): G11B5/48
CPC Code(s): G11B5/4846
Abstract: according to one embodiment, a suspension assembly includes a support plate, a head supported by the support plate, and a wiring member provided on the support plate, and constituted by a stacked layer body. the wiring member includes a distal portion electrically connected to the head, a connection end portion extending to an outside of the support plate, and a plurality of wirings. the connection end portion includes an opening extending in a first direction, a plurality of connection terminals each formed by a conductive layer and arranged in the first direction in the opening, and a partition provided at the connection terminal to protrude from the side of the second insulating layer.
20250079039. SECONDARY BATTERY AND BUS BAR_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Seishiro MATSUMURA of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Kuniaki YAMAMOTO of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Tatsumi MATSUO of Kokubunji Tokyo (JP) for kabushiki kaisha toshiba, Shinya TANIKAWA of Kita Tokyo (JP) for kabushiki kaisha toshiba, Wataru NITTA of Ota Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): H01B5/02, H01M10/613, H01M10/6551, H01M50/209, H01M50/503
CPC Code(s): H01B5/02
Abstract: according to one embodiment, a secondary battery includes a first battery cell including a first terminal, a second battery cell including a second terminal, and a bus bar. the bus bar includes a base portion, a first heat dissipation portion, a first opposing heat dissipation portion, a second heat dissipation portion, and a second opposing heat dissipation portion. the base portion includes first and second connecting portions. the first and second connecting portions are electrically connected to the first and second terminals, respectively. a first direction from the first connecting portion to the first opposing heat dissipating portion crosses a second direction from the first connecting portion to the second connecting portion. the first opposing heat dissipation portion is separated from the first connecting portion in the first direction. the second opposing heat dissipation portion is separated from the second connecting portion in the first direction.
Inventor(s): Masaaki OGAWA of Hakusan Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L21/78, H01L29/06
CPC Code(s): H01L21/78
Abstract: a semiconductor device according to the present embodiment includes a semiconductor element having a first face, a second face located on an opposite side to the first face, and a side face located between the first face and the second face. a first electrode layer is provided on the first face of the semiconductor element. a second electrode layer is provided on the second face of the semiconductor element. an outer edge portion on the second face is more rounded compared to an outer edge portion on the first face. a thickness of the second electrode layer gradually decreases as the second electrode layer extends closer to the side face.
20250079253. SEMICONDUCTOR DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Kento ADACHI of Tokyo (JP) for kabushiki kaisha toshiba, Satoshi YOSHIDA of Kawasaki (JP) for kabushiki kaisha toshiba, Tatsunori SAKANO of Tokyo (JP) for kabushiki kaisha toshiba, Tomoaki INOKUCHI of Yokohama (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L23/367, H01L23/00, H01L23/31, H01L23/498, H01L23/538, H01L25/065
CPC Code(s): H01L23/367
Abstract: an embodiment includes a first substrate, a second substrate, a first semiconductor element, a second semiconductor element and a third substrate. the third substrate is provided between the first substrate and the second substrate. the first semiconductor element is provided on the first substrate. the second semiconductor element is provided on the second substrate. the third substrate includes a first connection member and a second connection member that have thermal conductivity and penetrate through the third substrate. the first semiconductor element is thermally coupled to the first substrate and coupled through the first connection member to the second substrate. the second semiconductor element is thermally coupled to the second substrate and coupled through the second connection member to the first substrate.
20250079475. SEPARATOR OF ELECTROCHEMICAL CELL STACK_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Keisuke NAKAZAWA of Yokohama Kanagawa (JP) for kabushiki kaisha toshiba, Hiromasa KANOME of Ota Tokyo (JP) for kabushiki kaisha toshiba, Kiyoshi IMAI of Taito Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): H01M8/0228, H01M8/0206, H01M8/0213, H01M8/0263
CPC Code(s): H01M8/0228
Abstract: a separator of an embodiment is a separator of an electrochemical cell stack obtained by stacking a cell including a polymer electrolyte membrane, an anode electrode, and a cathode electrode, and the separator. the separator includes a substrate formed of a metal material, and a corrosion-resistant film formed on a surface on the anode electrode side of the substrate and a surface on the cathode electrode side of the substrate, and formed of crystals of a corrosion-resistant material. an arithmetic average roughness ra and a maximum height roughness rz at the surface of the substrate are smaller than a particle size of the crystals.
20250079682. COMPUTING DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Hayato GOTO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01P7/06, H01P5/02
CPC Code(s): H01P7/06
Abstract: according to one embodiment, a computing device includes an element section, a first conductive portion, a second conductive portion, a first coupling conductive portion, and a controller. the element section includes a first structure, a second structure, and a first coupling structure. the first structure includes a first cavity resonator having a first resonance frequency, a first other cavity resonator having a first other resonance frequency, and a first coupler configured to couple the first cavity resonator and the first other cavity resonator. the first other resonance frequency is lower than the first resonance frequency. the second structure includes a second cavity resonator having a second resonance frequency, a second other cavity resonator having a second other resonance frequency, and a second coupler configured to couple the second cavity resonator and the second other cavity resonator. the second other resonance frequency is lower than the second resonance frequency.
Inventor(s): Takashi TAKAGI of Kawasaki (JP) for kabushiki kaisha toshiba, Toshimitsu AIZAWA of Yokohama (JP) for kabushiki kaisha toshiba, Tadashi ASUKAI of Yokohama (JP) for kabushiki kaisha toshiba
IPC Code(s): H02P21/18, H02P27/06
CPC Code(s): H02P21/18
Abstract: according to one embodiment, a driving device includes a power converter, a voltage controller and a phase adjuster. the phase adjuster is configured to execute a first phase control process of receiving first information relating to a relationship between a phase of a motor current flowing through the motor and a rotational position of the motor, and adjusting the phase of the driving voltage, based on the first information. the phase adjuster is configured to execute a second phase control process of receiving second information relating to a magnitude of the motor current and third information relating to a rotational speed of the motor, and adjusting the phase of the driving voltage, based on the second information and the third information.
20250080094. COMPUTING DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Hiroomi CHONO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Hayato GOTO of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Taro KANAO of Kumagaya Saitama (JP) for kabushiki kaisha toshiba
IPC Code(s): H03K3/38, G06N10/40, H10N60/12
CPC Code(s): H03K3/38
Abstract: according to one embodiment, a computing device includes an element section, a first control member, and a controller. the element section includes a first qubit including a first loop including a plurality of first josephson junctions, and a second qubit including a second loop including a plurality of second josephson junctions. the second qubit is configured to be connected with the first qubit. the controller is configured to cause the first control member to execute a first operation. in the first operation, the controller is configured to cause the first control member to apply a pulse wave including a dc component to the first loop while applying a first signal wave including a first ac component to the first loop.
20250080105. DRIVING DEVICE AND SEMICONDUCTOR DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Tatsunori Sakano of Shinagawa Tokyo (JP) for kabushiki kaisha toshiba, Tomoko Matsudai of Tokyo (JP) for kabushiki kaisha toshiba, Ryohei Gejo of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H03K17/16, H01L29/739, H02M1/00, H02M1/08, H02M7/5387
CPC Code(s): H03K17/168
Abstract: an embodiment includes a controller and a driver. the controller controls to drive a semiconductor element having a first gate electrode and a second gate electrode base on a control signal. the driver outputs a first driving signal to the first gate electrode and a second driving signal to the second gate electrode. the first driving signal drives the first gate electrode at on or off timing of the control signal. the second driving signal drives the second gate electrode a timing earlier than the off timing of the control signal. the driver switches output impedances corresponding to the switching speed of the semiconductor element.
Inventor(s): Kazuaki DOI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba, Keisuke MERA of Katsushika Tokyo (JP) for kabushiki kaisha toshiba, Yutaro ISHIGAKI of Kawasaki Kanagawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H04L9/08
CPC Code(s): H04L9/0852
Abstract: according to an embodiment, an information processing device includes a processor that divides input data based on photons received via a quantum cryptographic communication channel into a plurality of pieces of first divided data, obtains first numeric theory translation data of the first divided data by performing numeric theory translation on the plurality of pieces of first divided data, divides a toeplitz matrix into a plurality of pieces of second divided data, obtains second numeric theory translation data of the second divided data by performing numeric theory translation on the plurality of pieces of second divided data, and performs privacy amplification processing on the input data based on a result obtained by performing inverse numeric theory translation on a multiplication result obtained by multiplying the first numeric theory translation data and the second numeric theory translation data.
Inventor(s): Masato HAYASHI of Komatsu Ishikawa (JP) for kabushiki kaisha toshiba, Tatsuo NAIJO of Kanazawa Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L29/739, H01L29/66
CPC Code(s): H10D12/481
Abstract: a semiconductor device includes a first electrode, a second electrode, a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer. a concentration of the first impurity has a maximum value at a first position in a first direction inside the first semiconductor layer. the first direction is from the first electrode toward the second electrode. a concentration of proton is greater than the concentration of the first impurity in the second semiconductor layer. the concentration of the first impurity is greater than the concentration of proton in the third semiconductor layer. the concentration of the first impurity is greater than the concentration of proton in at least a portion of the first semiconductor layer at the second semiconductor layer side. the concentration of proton has a maximum value at a second position positioned at a side of the first position opposite to the first direction.
Inventor(s): Yuki SHIBUTANI of Hakusan Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L29/78, H01L29/06, H01L29/40
CPC Code(s): H10D30/668
Abstract: a semiconductor device includes first to fourth electrodes, first to fourth semiconductor regions, and first and second insulating parts. the first semiconductor region is located on the first electrode. the second semiconductor region is located on the first semiconductor region. the third semiconductor region is located on the second semiconductor region. the second electrode is located on the third semiconductor region. the third electrode is arranged with the second semiconductor region. the first insulating part is located between the second semiconductor region and the third electrode. the fourth electrode is arranged with the first semiconductor region and the third electrode. the second insulating part is located between the first semiconductor region and the fourth electrode and between the third electrode and the fourth electrode. the fourth semiconductor region is located under the third electrode. the fourth semiconductor region is electrically connected with the second electrode.
20250081548. SEMICONDUCTOR DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Hiroki HATADA of Kanazawa Ishikawa (JP) for kabushiki kaisha toshiba, Tsuyoshi KACHI of Kanazawa Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L29/06, H01L29/04, H01L29/423
CPC Code(s): H10D62/117
Abstract: a semiconductor device includes first and second electrodes, first to third semiconductor regions, a structure body, and first and second connection parts. the structure body includes an insulating part, and third and fourth electrodes. a shape of the structure body in a plane is a first hexagon. the first hexagon includes a pair of first sides, a pair of second sides, and a pair of third sides. a length of the pair of first sides is greater than a length of the pair of second sides. the fourth electrode includes a pair of first electrode regions, a pair of second electrode regions, and a pair of third electrode regions. the second connection part is located on the pair of first electrode regions.
Inventor(s): Tsuyoshi KACHI of Kanazawa Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L29/40, H01L29/06, H01L29/66, H01L29/78
CPC Code(s): H10D64/112
Abstract: a semiconductor device includes a first electrode, a first semiconductor region of a first type including first and second regions, second semiconductor regions of a second type on the first region, third semiconductor regions of the first type on the second semiconductor regions, a second electrode electrically connected to the third semiconductor regions, first structures in the first region, each of which includes an insulating region and a conductive region, second structures in the second region, each of which includes an insulating region and a conductive region, a third electrode surrounding the first and second structures, a first insulating portion between the second semiconductor region and the third electrode, a second insulating portion above the second region, and a wiring portion above the second insulating portion and electrically connected to the third electrode.
20250081577. SEMICONDUCTOR DEVICE_simplified_abstract_(kabushiki kaisha toshiba)
Inventor(s): Masatsugu NAGAI of Nomi Ishikawa (JP) for kabushiki kaisha toshiba, Hiroki HATADA of Kanazawa Ishikawa (JP) for kabushiki kaisha toshiba
IPC Code(s): H01L29/41, H01L29/04, H01L29/739
CPC Code(s): H10D64/20
Abstract: a semiconductor device of embodiments includes: a semiconductor layer including a first semiconductor region of a first conductive type, a second semiconductor region of a second conductive type, and a third semiconductor region of the first conductive type; and a gate electrode. the second semiconductor region includes first, second, and third regions. the gate electrode includes first, second, and third portions. the first, second, and third portions face the first, second, and third regions, respectively. the first portion, the second portion, and the third portion contain a first material, a second material, and a third material, respectively. when the first conductive type is n-type, the work function of the first material and the third material are smaller than that of the second material. when the first conductive type is p-type, the work function of the first material and the third material are larger than that of the second material.
Inventor(s): Takeshi ARAKI of Koto Tokyo (JP) for kabushiki kaisha toshiba, Hirotaka ISHII of Shinagawa Tokyo (JP) for kabushiki kaisha toshiba
IPC Code(s): H10N60/85, H10N60/01
CPC Code(s): H10N60/858
Abstract: an oxide superconductor of an embodiment includes an oxide superconducting layer including a first superconducting region containing barium, copper, and a first rare earth element, having a continuous perovskite structure, and extending in a first direction, a second superconducting region containing barium, copper, and a second rare earth element, haying a continuous perovskite structure, and extending in the first direction, and a non-superconducting region disposed between the first and the second superconducting region, containing praseodymium, barium, copper, and a third rare earth element, a ratio of the number of atoms of the praseodymium to a sum of the number of atoms of the third rare earth element and the number of atoms of the praseodymium which is 20% or more, having a continuous perovskite structure continuous with the perovskite structure of the first superconducting region and the perovskite structure of the second superconducting region, and extending in the first direction.
KABUSHIKI KAISHA TOSHIBA patent applications on March 6th, 2025
- KABUSHIKI KAISHA TOSHIBA
- B23K35/02
- B22F1/103
- B23K1/00
- B23K35/30
- B23K101/42
- B23K103/18
- H01L21/48
- H01L23/00
- H01L23/373
- CPC B23K35/025
- Kabushiki kaisha toshiba
- C04B35/584
- B24B1/00
- CPC C04B35/584
- C25B11/091
- C25B9/77
- C25B11/031
- C25B13/02
- CPC C25B11/091
- E21B47/002
- E21B47/085
- CPC E21B47/0025
- G01C19/5677
- CPC G01C19/5677
- G01C19/5705
- CPC G01C19/5705
- G01C19/5712
- CPC G01C19/5712
- G01C19/5783
- CPC G01C19/5783
- G01D11/24
- G01D11/30
- CPC G01D11/245
- G01N21/88
- G01N21/93
- G06T7/00
- G06V10/60
- CPC G01N21/8851
- G01N27/18
- G01N27/04
- CPC G01N27/18
- G06F3/06
- CPC G06F3/0655
- G06F8/65
- G06F11/34
- CPC G06F8/65
- G06F16/901
- G06F16/28
- G06Q30/0601
- CPC G06F16/9024
- G06F30/12
- CPC G06F30/12
- G06N20/00
- CPC G06N20/00
- CPC G06T7/001
- G06V10/762
- G06V10/44
- CPC G06V10/762
- G06V10/774
- G06V10/26
- G06V10/82
- G06V10/94
- G06V10/98
- G06V20/69
- CPC G06V10/774
- G11B5/48
- CPC G11B5/4846
- H01B5/02
- H01M10/613
- H01M10/6551
- H01M50/209
- H01M50/503
- CPC H01B5/02
- H01L21/78
- H01L29/06
- CPC H01L21/78
- H01L23/367
- H01L23/31
- H01L23/498
- H01L23/538
- H01L25/065
- CPC H01L23/367
- H01M8/0228
- H01M8/0206
- H01M8/0213
- H01M8/0263
- CPC H01M8/0228
- H01P7/06
- H01P5/02
- CPC H01P7/06
- H02P21/18
- H02P27/06
- CPC H02P21/18
- H03K3/38
- G06N10/40
- H10N60/12
- CPC H03K3/38
- H03K17/16
- H01L29/739
- H02M1/00
- H02M1/08
- H02M7/5387
- CPC H03K17/168
- H04L9/08
- CPC H04L9/0852
- H01L29/66
- CPC H10D12/481
- H01L29/78
- H01L29/40
- CPC H10D30/668
- H01L29/04
- H01L29/423
- CPC H10D62/117
- CPC H10D64/112
- H01L29/41
- CPC H10D64/20
- H10N60/85
- H10N60/01
- CPC H10N60/858
