IoT/Sensors patent applications on March 13th, 2025

Patent Applications for IoT/Sensors on March 13th, 2025

Number of patent applications containing 'IoT/Sensors' or its variations: 6

LabScale Technologies, Inc. (20250086091). SYSTEMS AND METHODS FOR LAB GENERATION, TEST MANAGEMENT AND DEVICE MONITORING

Organization: LabScale Technologies, Inc.

Inventor(s): David Tse of San Jose CA (US) for LabScale Technologies, Inc., Scott Vail of Santa Cruz CA (US) for LabScale Technologies, Inc., Huacong Cai of Santa Clara CA (US) for LabScale Technologies, Inc., Raika Qawam of Livermore CA (US) for LabScale Technologies, Inc., Craig Griffin of San Jose CA (US) for LabScale Technologies, Inc.

IPC Code(s): G06F11/34, G06F11/36

CPC Code(s): G06F11/3466

BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED (20250086460). METHOD AND APPARATUS FOR COMPRESSING TOPOLOGY RECOGNITION MODEL, ELECTRONIC DEVICE, AND MEDIUM

Organization: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED

Inventor(s): Jianan Yuan of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Chao Huo of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Huifeng Bai of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Ganghong Zhang of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Jian Gao of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Libin Zheng of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Huadong Yu of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Zhibin Yin of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Anqin Luo of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Fan Xie of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Yifan Shen of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Shuangshuang Yang of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED, Xiao Ding of Beijing (CN) for BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED

IPC Code(s): G06N3/082, G06N3/0495

CPC Code(s): G06N3/082

Samsung Electronics Co., Ltd. (20250088313). METHOD AND APPARATUS FOR TRANSMITTING UPLINK CHANNEL IN WIRELESS COMMUNICATION SYSTEM

Organization: Samsung Electronics Co., Ltd.

Inventor(s): Junyung YI of Suwon-si (KR) for Samsung Electronics Co., Ltd., Youngbum KIM of Suwon-si (KR) for Samsung Electronics Co., Ltd., Jeongho YEO of Suwon-si (KR) for Samsung Electronics Co., Ltd., Seunghoon CHOI of Suwon-si (KR) for Samsung Electronics Co., Ltd., Taehan BAE of Suwon-si (KR) for Samsung Electronics Co., Ltd.

IPC Code(s): H04L1/08, H04W72/0446, H04W72/21

CPC Code(s): H04L1/08

Samsung Electronics Co., Ltd. (20250088866). METHOD AND APPARATUS FOR FORWARDING INFORMATION IN COMMUNICATION SYSTEM

Organization: Samsung Electronics Co., Ltd.

Inventor(s): Jingxing FU of Beijing (CN) for Samsung Electronics Co., Ltd., Feifei SUN of Beijing (CN) for Samsung Electronics Co., Ltd., Sa ZHANG of Beijing (CN) for Samsung Electronics Co., Ltd.

IPC Code(s): H04W16/28, H04W56/00, H04W72/231, H04W74/0808

CPC Code(s): H04W16/28

Samsung Electronics Co., Ltd. (20250088924). METHOD AND APPARATUS FOR CONFIGURING AND INDICATING BEAM INFORMATION IN WIRELESS COMMUNICATION SYSTEM

Organization: Samsung Electronics Co., Ltd.

Inventor(s): Hoondong NOH of Suwon-si (KR) for Samsung Electronics Co., Ltd., Youngwoo KWAK of Suwon-si (KR) for Samsung Electronics Co., Ltd.

IPC Code(s): H04W36/06, H04B7/06, H04L5/00, H04W72/044

CPC Code(s): H04W36/06

Telefonaktiebolaget LM Ericsson (publ) (20250089100). Mobile-Terminated Early Data Transmission

Organization: Telefonaktiebolaget LM Ericsson (publ)

Inventor(s): Andreas Höglund of Solna (SE) for Telefonaktiebolaget LM Ericsson (publ), Dung Pham Van of Upplands Väsby (SE) for Telefonaktiebolaget LM Ericsson (publ), Tuomas Tirronen of Helsinki (FI) for Telefonaktiebolaget LM Ericsson (publ), Emre Yavuz of Stockholm (SE) for Telefonaktiebolaget LM Ericsson (publ)

IPC Code(s): H04W74/0833, H04W4/70, H04W8/24, H04W76/10

CPC Code(s): H04W74/0833