International business machines corporation (20240347497). THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS simplified abstract
Contents
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
Organization Name
international business machines corporation
Inventor(s)
SHIDONG Li of Hopewell Junction NY (US)
Kenneth Charles Marston of Poughquag NY (US)
Kalind Baraya of West Lafayette IN (US)
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347497 titled 'THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
The semiconductor structures in this patent application are equipped with five different cooling elements that are directly bonded to a semiconductor chip. These cooling elements can be bonded to the backside of a thinned semiconductor substrate or to the front side back-end-of-line (BEOL) interconnect wiring of the semiconductor chip. The cooling element serves to replace a carrier wafer on semiconductor chips with backside BEOL interconnect wiring. Each of the five cooling elements provides improved thermal conductivity for the semiconductor structure when directly bonded to the front side BEOL interconnect wiring compared to the carrier wafer typically bonded to a semiconductor chip with backside BEOL interconnect wiring. The cooling element options include a copper cooling element with water-filled microchannels, a copper plate, a silicon cooling element with water-filled microchannels, a silicon carbide plate, or a glass plate with copper-filled vias. These cooling elements are directly bonded to the semiconductor chip using a hybrid bond.
- Copper cooling element with water-filled microchannels
- Copper plate
- Silicon cooling element with water-filled microchannels
- Silicon carbide plate
- Glass plate with copper-filled vias
Potential Applications: - High-performance computing - Data centers - Telecommunications infrastructure - Automotive electronics - Aerospace technology
Problems Solved: - Improved thermal management in semiconductor structures - Enhanced heat dissipation capabilities - Increased overall performance and reliability of electronic devices
Benefits: - Better thermal conductivity - Improved cooling efficiency - Extended lifespan of semiconductor chips - Enhanced overall performance
Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Devices This technology can be utilized in various commercial applications such as high-performance computing systems, data centers, telecommunications infrastructure, automotive electronics, and aerospace technology. The market implications include improved efficiency, reliability, and performance of electronic devices.
Questions about Semiconductor Cooling Technology: 1. How does the direct bonding of cooling elements improve thermal conductivity in semiconductor structures? 2. What are the key advantages of using different types of cooling elements in semiconductor chips?
Original Abstract Submitted
semiconductor structures are provided with five different cooling elements directly bonded to a semiconductor chip. the cooling element is directly bonded to the backside of a thinned semiconductor substrate or to the front side back-end-of-line (beol) interconnect wiring of the semiconductor chip. the cooling element replaces a carrier wafer on semiconductor chips with backside beol interconnect wiring. each of the five cooling elements provide better thermal conductivity for the semiconductor structure when directly bonded to the front side beol interconnect wiring than the carrier wafer typically bonded to a semiconductor chip with backside beol interconnect wiring. the cooling element is one of a copper cooling element with water-filled microchannels, or a copper plate, a silicon cooling element with water-filled microchannels, a silicon carbide plate, or a glass plate with copper-filled vias. the cooling element is directly bonded to the semiconductor chip by a hybrid bond.
