International business machines corporation (20240332194). CHIP MODULE ASSEMBLY simplified abstract
Contents
CHIP MODULE ASSEMBLY
Organization Name
international business machines corporation
Inventor(s)
Mukta Ghate Farooq of Hopewell Junction NY (US)
CHIP MODULE ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332194 titled 'CHIP MODULE ASSEMBLY
Simplified Explanation: The patent application describes an electronic device with a chip module assembly that includes semiconductor chip pairs interconnected by a bridge die.
Key Features and Innovation:
- Chip module assembly with first and second semiconductor chip pairs connected through a bridge die.
- Efficient interconnection design for semiconductor chips.
- Improved performance and reliability of electronic devices.
Potential Applications: This technology can be used in:
- Mobile devices
- Computers
- IoT devices
Problems Solved:
- Enhanced connectivity between semiconductor chips.
- Improved overall functionality of electronic devices.
Benefits:
- Increased performance and efficiency.
- Enhanced reliability and durability.
- Cost-effective manufacturing process.
Commercial Applications: Title: Advanced Semiconductor Chip Interconnection Technology This technology can be utilized in various industries such as:
- Consumer electronics
- Telecommunications
- Automotive
Prior Art: Readers can explore prior art related to semiconductor chip interconnection technologies in the field of electronic devices.
Frequently Updated Research: Stay updated on the latest advancements in semiconductor chip interconnection technologies for electronic devices.
Questions about Semiconductor Chip Interconnection Technology: 1. What are the potential challenges in implementing this technology in mass production? 2. How does this technology compare to existing methods of semiconductor chip interconnection?
Original Abstract Submitted
an electronic device including a chip module assembly is provided. the chip module assembly includes at least one first semiconductor chip pair located at a first chip level, a bridge die interconnecting the at least one first semiconductor chip pair, and at least one second semiconductor chip pair located on top of the first chip level, wherein the at least one second chip pair are connected to each other through the at least one first semiconductor chip pair and the bridge die.
