International business machines corporation (20240332121). ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES simplified abstract

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES

Organization Name

international business machines corporation

Inventor(s)

Mukta Ghate Farooq of Hopewell Junction NY (US)

John Knickerbocker of Monroe NY (US)

Keiji Matsumoto of Yokohama-shi (JP)

ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240332121 titled 'ELECTRICALLY-INSULATING AND HIGHLY THERMAL CONDUCTIVE SHEET FOR ELECTRONIC DEVICES

The abstract describes an electronic device with an electrically-insulating and highly thermal conductive sheet at the interconnect level, reducing the temperature of the device without causing excess stress.

• The presence of the electrically-insulating and highly thermal conductive sheet at the interconnect level significantly reduces the temperature of the electronic device.
• The innovation improves the performance and reliability of electronic devices.
• The sheet does not cause excess stress in the electronic device.
• The technology enhances the thermal management of electronic devices.
• The innovation provides a solution for maintaining optimal operating temperatures in electronic devices.

Potential Applications: - Consumer electronics - Industrial machinery - Automotive systems - Aerospace technology - Medical devices

Problems Solved: - Overheating of electronic devices - Thermal stress on components - Reduced performance due to high temperatures

Benefits: - Improved device performance - Enhanced reliability - Extended lifespan of electronic devices - Better thermal management - Increased efficiency

Commercial Applications: Title: Enhanced Thermal Management Technology for Electronic Devices This technology can be utilized in various industries such as consumer electronics, automotive, aerospace, and medical devices to improve the performance and reliability of electronic systems. The market implications include increased demand for more efficient and reliable electronic devices.

Questions about the Technology: 1. How does the presence of the electrically-insulating and highly thermal conductive sheet improve the performance of electronic devices? 2. What are the potential long-term benefits of implementing this thermal management technology in various industries?

Original Abstract Submitted

an electronic device in which an electrically-insulating and highly thermal conductive sheet is located at the interconnect level is provided. the presence of the electrically-insulating and highly thermal conductive sheet at the interconnect level provides a significant reduction in the temperature of the electronic device, without causing excess stress in the electronic device. this results in electronic devices that have improved performance and reliability.