International business machines corporation (20240250070). FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS simplified abstract

FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS

Organization Name

international business machines corporation

Inventor(s)

Kyu-hyoun Kim of Chappaqua NY (US)

Arvind Kumar of Stamford CT (US)

Joshua M. Rubin of Albany NY (US)

John W. Golz of Hopewell Junction NY (US)

Mounir Meghelli of Tarrytown NY (US)

FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240250070 titled 'FACILITATOR DIES FOR HETEROGENEOUS DIE STACKS

The abstract of this patent application describes methods and structures for three-dimensional integrated circuits (3D ICs) with facilitator dies in a hierarchical configuration.

• Forming a plurality of stacked dies, including a bottom die with a first die type, upper dies with a second die type different from the first, and a facilitator die with a third die type different from the first two.
• Hierarchically forming signal connections and power distribution lines between the bottom die, upper dies, and facilitator die.

Potential Applications: - Advanced semiconductor manufacturing - High-performance computing - Aerospace and defense technology

Problems Solved: - Enhancing signal integrity in 3D ICs - Improving power distribution efficiency - Facilitating complex circuit designs

Benefits: - Increased performance and reliability of integrated circuits - Reduced power consumption and heat generation - Simplified design and manufacturing processes

Commercial Applications: Title: "Innovative Hierarchical Configuration for 3D Integrated Circuits" This technology could be utilized in industries such as telecommunications, automotive electronics, and medical devices, where high-performance and compact circuitry are essential.

Questions about the technology: 1. How does the hierarchical configuration of facilitator dies improve the efficiency of power distribution in 3D ICs? 2. What are the key differences between the die types used in the stacked configuration of this patent application?

Original Abstract Submitted

embodiments of the present invention are directed to processing methods and resulting structures for three-dimensional integrated circuits (3d ics) having facilitator dies in a hierarchical configuration. in a non-limiting embodiment, a method includes forming a plurality of stacked dies. the plurality of stacked dies includes a bottom die having a first die type, a plurality of upper dies having a second die type different than the first die type, and a facilitator die having a third die type different than the first die type and the second die type. at least one of a signal connection and a power distribution line are formed hierarchically between the bottom die, the plurality of upper dies, and the facilitator die.