International business machines corporation (20240243062). HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN simplified abstract

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HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

Organization Name

international business machines corporation

Inventor(s)

Tao Li of Slingerlands NY (US)

Ruilong Xie of Niskayuna NY (US)

Mukta Ghate Farooq of HOPEWELL JUNCTION NY (US)

Kisik Choi of Watervliet NY (US)

HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240243062 titled 'HETEROGENEOUS INTEGRATION OF DEVICE DIE HAVING BSPDN

The semiconductor structure described in the patent application includes a device die with a device layer, a back-end-of-line (BEOL) structure on the frontside of the device layer, a frontside substrate attached to the BEOL structure, a backside power distribution network (BSPDN) structure on the backside of the device layer, and a backside substrate attached to the BSPDN structure. Additionally, a device package consisting of a base element and a lid element is included, with the device die attached to the base element through multiple C4 bumps at the frontside substrate and to the lid element at the backside substrate.

  • Device structure with device die, BEOL structure, frontside substrate, BSPDN structure, backside substrate, and device package.
  • Attachment of device die to base element of device package through C4 bumps at frontside substrate.
  • Attachment of device die to lid element of device package at backside substrate.

Potential Applications: - Semiconductor manufacturing - Electronic device packaging - Power distribution networks

Problems Solved: - Efficient attachment of device die to device package - Improved power distribution within semiconductor structures

Benefits: - Enhanced reliability of semiconductor devices - Simplified manufacturing processes - Increased performance of electronic devices

Commercial Applications: - Semiconductor industry - Electronics manufacturing - Power management systems

Questions about the technology: 1. How does the attachment of the device die to the base and lid elements of the device package impact overall device performance? 2. What are the specific advantages of having a backside power distribution network (BSPDN) structure in the semiconductor device?


Original Abstract Submitted

embodiments of present invention provide a semiconductor structure. the structure includes a device die including a device layer; a back-end-of-line (beol) structure on a frontside of the device layer and a frontside substrate attached to the beol structure; and a backside power distribution network (bspdn) structure on a backside of the device layer and a backside substrate attached to the bspdn structure; and a device package including a base element and a lid element, wherein the device die is attached to the base element of the device package through multiple c4 bumps at the frontside substrate and is attached to the lid element of the device package at the backside substrate. a method of forming the same is also provided.

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