International business machines corporation (20240220696). CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE simplified abstract

CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE

Organization Name

international business machines corporation

Inventor(s)

David Wolpert of Poughkeepsie NY (US)

Leon Sigal of Monsey NY (US)

Ruilong Xie of Niskayuna NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Biswanath Senapati of Mechanicville NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240220696 titled 'CELL-BASED SIGNAL CONNECTIVITY BETWEEN WAFER FRONTSIDE AND BACKSIDE

The semiconductor structure described in the patent application includes multiple backside metal rails and signal wires, as well as gate metal pitches and signal vias connecting the backside and frontside signal wires.

• The structure features a first backside metal rail, a second backside metal rail, and a third backside metal rail, which together bound two circuit rows.
• A backside signal wire interrupts the second backside metal rail, providing additional functionality to the structure.
• Gate metal pitches extend perpendicularly to the backside metal rails, enhancing the overall design of the structure.
• A frontside signal wire is positioned above the gate metal pitches, while a signal via connects the backside and frontside signal wires.

Potential Applications: - This semiconductor structure could be used in various electronic devices such as smartphones, tablets, and computers. - It may find applications in the telecommunications industry for signal processing and data transmission.

Problems Solved: - The structure provides a compact and efficient layout for electronic circuits, optimizing space and performance. - The integration of multiple metal rails and signal wires enhances signal processing capabilities.

Benefits: - Improved signal transmission and processing efficiency. - Space-saving design for electronic devices. - Enhanced overall performance of electronic circuits.

Commercial Applications: "Semiconductor Structure with Multiple Metal Rails and Signal Wires: Commercial Uses and Market Implications"

Frequently Updated Research: - Stay updated on advancements in semiconductor technology and integrated circuit design for potential improvements in signal processing and data transmission efficiency.

Questions about Semiconductor Structure with Multiple Metal Rails and Signal Wires: 1. How does the integration of multiple metal rails and signal wires impact the overall performance of electronic circuits? 2. What are the potential applications of this semiconductor structure in the telecommunications industry?

Original Abstract Submitted

a semiconductor structure includes a first backside metal rail that extends across the structure and a second backside metal rail parallel and adjacent to the first backside metal rail. the first and second backside metal rails bound a first circuit row. the structure also includes a backside signal wire that interrupts the second backside metal rail; and a third backside metal rail that extends across the structure parallel and adjacent to the second backside metal rail. the second and third backside metal rails bound a second circuit row. the structure also includes gate metal pitches, which extend across the structure perpendicular to the backside metal rails. the structure also includes a frontside signal wire above the gate metal pitches; and a signal via that penetrates the structure and connects the backside signal wire to the frontside signal wire.