International business machines corporation (20240213217). CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST simplified abstract

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

Organization Name

international business machines corporation

Inventor(s)

David Michael Audette of Colchester VT (US)

Grant Wagner of Jericho VT (US)

Steven Paul Ostrander of Poughkeepsie NY (US)

Hubert Harrer of Schoenaich (DE)

Arvind Kumar of Chappaqua NY (US)

Thomas Anthony Wassick of LaGrangeville NY (US)

Matthew Sean Grady of Burlington VT (US)

Sungjun Chun of Austin TX (US)

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240213217 titled 'CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

The patent application describes an apparatus with a chip package containing an array of micro-bumps on the chip connection surface, organized into subarrays with specific spacing. A laminate circuit card with an array of card pads aligned to the micro-bumps is also included in the apparatus.

• The apparatus includes a chip package with an array of micro-bumps on the chip connection surface.
• The micro-bumps are organized into subarrays with specific spacing.
• A laminate circuit card with an array of card pads aligned to the micro-bumps is part of the apparatus.
• An interposer may connect the card pads to the micro-bumps, potentially including decoupling capacitors.
• The spacing between micro-bumps and subarrays is carefully designed for optimal performance.

Potential Applications: - This technology can be used in advanced electronic devices requiring high-density interconnections. - It can be applied in the manufacturing of compact and efficient electronic systems.

Problems Solved: - Provides a solution for achieving high-density interconnections in electronic devices. - Offers a method for optimizing the performance of chip packages and laminate circuit cards.

Benefits: - Improved efficiency and performance in electronic devices. - Enhanced reliability and connectivity in compact systems.

Commercial Applications: Title: High-Density Interconnection Technology for Advanced Electronic Devices This technology can be utilized in the production of smartphones, tablets, and other portable electronic devices, as well as in data centers and high-performance computing systems.

Questions about High-Density Interconnection Technology: 1. How does this technology improve the efficiency of electronic devices? - This technology enhances connectivity and reliability in electronic systems by optimizing the interconnection process. 2. What are the potential challenges in implementing this high-density interconnection technology? - The main challenges may include manufacturing complexity and ensuring precise alignment between the micro-bumps and card pads.

Original Abstract Submitted

an apparatus includes a chip package that has a chip connection surface and has an array of micro-bumps on the chip connection surface. the array of micro-bumps includes a plurality of subarrays of micro-bumps. micro-bumps within each subarray are spaced apart by a chip pitch and the subarrays within the array are spaced apart by a card pitch that is an integer multiple of the chip pitch. the apparatus also includes a laminate circuit card that has a card connection surface that faces the chip connection surface of the chip package and that has an array of card pads adjacent to the card connection surface. the card pads are spaced apart by the card pitch, and each of the card pads is aligned to and electrically connected with a corresponding subarray of micro-bumps. in some embodiments, an interposer connects the card pads to the micro-bumps, and may include decoupling capacitors.