International business machines corporation (20240203996). HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK simplified abstract

HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK

Organization Name

international business machines corporation

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Albert M. Chu of Nashua NH (US)

Reinaldo Vega of Mahopac NY (US)

Brent A. Anderson of Jericho VT (US)

HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203996 titled 'HYBRID CELL HEIGHT DESIGN WITH A BACKSIDE POWER DISTRIBUTION NETWORK

The abstract of this patent application describes a multi-layer integrated circuit structure with signal lines in the back-end-of-line region and power rails in the backside region of a wafer.

• The integrated circuit structure includes a back-end-of-line region at one side of the wafer and a backside region at the opposite side.
• Signal lines with a constant pitch are located in the back-end-of-line region.
• Power rails with varying pitch are situated in the backside region.

Potential Applications: This technology could be used in the semiconductor industry for advanced integrated circuit designs requiring efficient power distribution and signal transmission.

Problems Solved: This innovation addresses the need for optimized power delivery and signal integrity in complex integrated circuits.

Benefits: - Improved performance and reliability of integrated circuits. - Enhanced power distribution efficiency. - Better signal transmission quality.

Commercial Applications: This technology could be valuable for companies involved in the development of high-performance electronic devices, such as smartphones, computers, and IoT devices.

Questions about the Technology: 1. How does the varying pitch of power rails in the backside region impact the overall performance of the integrated circuit? 2. What are the specific challenges in manufacturing multi-layer integrated circuits with signal lines and power rails in different regions of the wafer?

Original Abstract Submitted

embodiments of the invention provide a multi-layer integrated circuit (ic) structure that includes a back-end-of-line (beol) region at a first side of a wafer. a backside region is at a second side of the wafer that is opposite the first side of the wafer. a set of signal lines are in the beol region, and a set of power rails are in the backside region. the set of signal lines includes a substantially constant signal-line pitch between each signal line in the set of signal lines. the set of power rails includes a substantially varying power-rail pitch between each power rail in the set of power rails.