International business machines corporation (20240203984). STACKED TRANSISTORS WITH STEPPED CONTACTS simplified abstract
Contents
STACKED TRANSISTORS WITH STEPPED CONTACTS
Organization Name
international business machines corporation
Inventor(s)
Indira Seshadri of Niskayuna NY (US)
Jay William Strane of Warwick NY (US)
STACKED TRANSISTORS WITH STEPPED CONTACTS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240203984 titled 'STACKED TRANSISTORS WITH STEPPED CONTACTS
The abstract of this patent application describes semiconductor devices and methods of forming them. It involves a lower semiconductor device over a substrate with a first width, and an upper semiconductor device over the lower one with a second width smaller than the first. A dielectric structure is also present over the lower semiconductor device, with sidewalls that align vertically with the lower semiconductor device.
- Lower semiconductor device over a substrate
- Upper semiconductor device with a smaller width than the lower one
- Dielectric structure with aligned sidewalls
- Formation methods for semiconductor devices
- Substrate as a base for the semiconductor devices
Potential Applications: - Semiconductor manufacturing - Electronics industry - Integrated circuits
Problems Solved: - Improving semiconductor device performance - Enhancing device integration - Optimizing space utilization
Benefits: - Increased efficiency in semiconductor manufacturing - Enhanced device performance - Improved integration capabilities
Commercial Applications: Title: Advanced Semiconductor Device Manufacturing for Enhanced Performance This technology can be used in the production of various electronic devices, such as smartphones, computers, and other consumer electronics. It can also benefit industries that rely on semiconductor devices for their operations, such as telecommunications and automotive.
Questions about Semiconductor Devices: 1. How do semiconductor devices impact modern technology? Semiconductor devices play a crucial role in powering various electronic devices we use daily, from smartphones to computers, by enabling the flow of electrical currents. 2. What are the key differences between lower and upper semiconductor devices in this context? The lower semiconductor device serves as the base over the substrate, while the upper semiconductor device is positioned above it with a smaller width, allowing for more efficient integration within the device architecture.
Original Abstract Submitted
semiconductor devices and methods of forming the same include a lower semiconductor device over a substrate, the lower semiconductor device having a first width. an upper semiconductor device is over the lower semiconductor device. the upper semiconductor device has a second width smaller than the first width. a dielectric structure is over the lower semiconductor device and has a first sidewall that faces the upper semiconductor device and a second sidewall that aligns vertically with a sidewall of the lower semiconductor device.
