International business machines corporation (20240203982). DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH simplified abstract

DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH

Organization Name

international business machines corporation

Inventor(s)

Reinaldo Vega of Mahopac NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

David Wolpert of Poughkeepsie NY (US)

Takashi Ando of Eastchester NY (US)

DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203982 titled 'DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POWERVIA TRENCH

The abstract of the patent application describes a logic cell that includes a first trench capacitor connecting a topside metal layer to a backside metal layer. The first trench capacitor consists of an outer plate connected to a first power rail on the backside metal layer, an inner plate connected to a second power rail on the backside metal layer, and an insulating layer separating the inner plate from the outer plate.

• Simplified Explanation:

- A logic cell with a first trench capacitor connects metal layers. - The capacitor has an outer plate, inner plate, and insulating layer.

• Key Features and Innovation:

- First trench capacitor design. - Connection between topside and backside metal layers. - Use of power rails for capacitor plates.

• Potential Applications:

- Integrated circuits. - Semiconductor devices. - Memory storage systems.

• Problems Solved:

- Efficient power distribution. - Improved signal processing. - Enhanced circuit performance.

• Benefits:

- Higher functionality. - Increased reliability. - Better power management.

• Commercial Applications:

- Semiconductor manufacturing industry. - Electronics and technology sector. - Research and development companies.

• Questions about Logic Cell Technology:

1. How does the first trench capacitor improve circuit performance? 2. What are the advantages of connecting metal layers in a logic cell?

• Frequently Updated Research:

- Ongoing studies on capacitor design in logic cells. - Research on power distribution in integrated circuits.

Original Abstract Submitted

a logic cell includes a first trench capacitor disposed between and connecting a topside metal layer to a backside metal layer. the first trench capacitor includes an outer plate, connected to a first power rail on the backside metal layer, an inner plate, connected to a second power rail on backside metal layer, and an insulating layer separating the inner plate from the outer plate.