International business machines corporation (20240203880). SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT simplified abstract

SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT

Organization Name

international business machines corporation

Inventor(s)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Albert M. Chu of Nashua NH (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Brent A. Anderson of Jericho VT (US)

Reinaldo Vega of Mahopac NY (US)

SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203880 titled 'SEMICONDUCTOR DEVICE WITH POWER SUPPLY DISTRIBUTION NETWORKS ON FRONTSIDE AND BACKSIDE OF A CIRCUIT

The abstract of this patent application describes a semiconductor device with separate power supplies for front side and backside stacked power distribution.

• The semiconductor device includes one or more circuits, a first power supply, a second power supply, and a third power supply.
• The first power supply is located on a first side of the circuits, while the second power supply is also on the first side.
• The third power supply is positioned on a second side of the circuits, opposite to the first side.

Potential Applications: This technology could be used in various semiconductor devices that require separate power supplies for different sides of the circuits.

Problems Solved: This innovation addresses the need for efficient power distribution in semiconductor devices, ensuring optimal performance and reliability.

Benefits: The separate power supplies for front side and backside stacked power distribution can improve the overall efficiency and functionality of semiconductor devices.

Commercial Applications: This technology could have commercial applications in the semiconductor industry, particularly in the development of advanced electronic devices.

Questions about Semiconductor Device with Separate Power Supplies: 1. How does this technology improve the performance of semiconductor devices? 2. What are the potential challenges in implementing separate power supplies for front side and backside stacked power distribution in semiconductor devices?

Original Abstract Submitted

one or more systems, devices, and/or methods of use provided herein relate to a semiconductor device with separate power supplies for front side and backside stacked power distribution. a semiconductor device can include one or more circuits, a first power supply, a second power supply, and a third power supply. the first power supply can be disposed on a first side of the one or more circuits. the second power supply can be disposed on the first side of the one or more circuits. further, the third power supply can be disposed on a second side of the one or more circuits. additionally, the first side of the one or more circuits can be opposite to the second side of the one or more circuits.