International business machines corporation (20240203822). THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING simplified abstract

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

Organization Name

international business machines corporation

Inventor(s)

Evan Colgan of Montvale NJ (US)

Jae-Woong Nah of Closter NJ (US)

Katsuyuki Sakuma of Fishkill NY (US)

Kamal K. Sikka of Poughkeepsie NY (US)

Joshua M. Rubin of Albany NY (US)

Frank Robert Libsch of White Plains NY (US)

THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203822 titled 'THERMAL EXPANSION MATCHED CHIP MODULE WITH INTEGRATED LIQUID COOLING

The abstract describes a chip and cooler assembly that includes an interposer with integrated circuit chips mounted on the back side, a frame fitted into the gaps between the chips, and a cooler module attached to the back side surface.

• The assembly features an interposer with chips mounted on the back side, each with a front side attached to the interposer.
• Gaps separate the chips, and a frame is fitted into these gaps, CTE-matched to the chips.
• The frame and chips define a back side surface where a cooler module is attached, CTE-matched to the chips.
• The cooler module includes a microchannel cooler directly against the chips and a manifold attached to the microchannel cooler, CTE-matched to it.

Potential Applications: - High-performance computing systems - Data centers - Telecommunications equipment

Problems Solved: - Efficient cooling of integrated circuit chips - Thermal management in densely packed chip assemblies

Benefits: - Improved heat dissipation - Enhanced performance and reliability of electronic devices

Commercial Applications: Title: Advanced Cooling Solutions for High-Performance Electronics This technology can be used in servers, supercomputers, and other high-performance electronic devices to ensure optimal thermal management, leading to increased efficiency and longevity.

Questions about the technology: 1. How does the cooler module improve the performance of the integrated circuit chips? 2. What are the key advantages of using a frame in the chip and cooler assembly?

Original Abstract Submitted

a chip and cooler assembly includes an active or passive interposer that has a front side and a back side. integrated circuit chips are mounted onto the back side of the interposer. each of the chips has a front side that is attached to the interposer and a back side that faces away from the interposer. gaps separate the chips. the assembly also includes a frame that is fitted into the gaps between the chips. the frame is cte-matched to the chips. the frame and the chips define a back side surface. a cooler module is attached to the back side surface. the cooler module is cte-matched to the chips. the cooler module includes a microchannel cooler that is disposed directly against the back sides of the chips and a manifold that is attached to the microchannel cooler opposite the chips. the manifold is cte-matched to the microchannel cooler.