International business machines corporation (20240203816). HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS simplified abstract

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

Organization Name

international business machines corporation

Inventor(s)

Kisik Choi of Watervliet NY (US)

Nicholas Alexander Polomoff of Hopewell Junction NY (US)

Brent A. Anderson of Jericho VT (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Ruilong Xie of Niskayuna NY (US)

Terence Hook of Jericho Center VT (US)

Matthew Angyal of Stormville NY (US)

FEE LI Lie of Albany NY (US)

HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240203816 titled 'HEAT DISSIPATION STRUCTURES FOR BONDED WAFERS

The patent application describes semiconductor devices and methods that involve a front-end-of-line (FEOL) layer and a back-end-of-line (BEOL) layer with a thermal transfer structure. A carrier wafer is bonded to the BEOL layer and includes a thermal dissipation structure in contact with the thermal transfer structure.

• FEOL layer and BEOL layer integration
• Thermal transfer structure in the BEOL layer
• Carrier wafer with thermal dissipation structure
• Improved thermal management in semiconductor devices
• Enhanced performance and reliability of the devices

Potential Applications: - Semiconductor manufacturing - Electronics industry - Thermal management systems

Problems Solved: - Heat dissipation in semiconductor devices - Thermal stress management - Enhanced device performance and longevity

Benefits: - Improved thermal efficiency - Enhanced device reliability - Increased performance capabilities

Commercial Applications: Title: "Advanced Thermal Management Solutions for Semiconductor Devices" This technology can be utilized in various commercial applications such as: - High-performance computing - Automotive electronics - Aerospace industry

Questions about Semiconductor Devices with Advanced Thermal Management Solutions: 1. How does the integration of FEOL and BEOL layers improve thermal management in semiconductor devices?

  - The integration allows for more efficient heat transfer and dissipation, enhancing overall device performance.

2. What are the potential long-term benefits of using thermal dissipation structures in carrier wafers?

  - The use of thermal dissipation structures can lead to increased device reliability and longevity.

Original Abstract Submitted

semiconductor devices and methods of forming the same include a front-end-of-line (feol) layer. a back-end-of-line (beol) layer includes a thermal transfer structure in contact with the feol layer. a carrier wafer is bonded to the beol layer and includes a thermal dissipation structure in contact with the thermal transfer structure.