International business machines corporation (20240194601). POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN simplified abstract

POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN

Organization Name

international business machines corporation

Inventor(s)

Albert M. Chu of Nashua NH (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Albert M. Young of Fishkill NY (US)

Junli Wang of Slingerlands NY (US)

Brent A. Anderson of Jericho VT (US)

Ruilong Xie of Niskayuna NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

REINALDO Vega of Mahopac NY (US)

POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240194601 titled 'POWER TAP CELL FOR FRONT SIDE POWER RAIL CONNECTION TO BSPDN

The semiconductor structure described in the patent application consists of circuit rows, first power rails on the front sides of the circuit rows, second power rails on the back sides of the circuit rows, and power tap cells associated with each circuit row. These power tap cells contain power vias that connect the first power rails to the second power rails.

• The structure includes orthogonal second power rails and horizontally offset first power rails.
• The power vias consist of at least two different sized power vias.

• • Potential Applications:**

This technology could be used in the design and manufacturing of semiconductor devices, integrated circuits, and other electronic components.

• • Problems Solved:**

This innovation addresses the need for efficient power distribution within semiconductor structures, improving overall performance and reliability.

• • Benefits:**

The use of power tap cells with different sized power vias allows for more flexible and optimized power distribution, leading to enhanced functionality and efficiency in electronic devices.

• • Commercial Applications:**

This technology could have significant commercial applications in the semiconductor industry, particularly in the development of advanced electronic devices with improved power management capabilities.

• • Prior Art:**

Prior research in semiconductor design and power distribution methods may provide valuable insights into similar technologies and approaches.

• • Frequently Updated Research:**

Ongoing research in semiconductor materials, device fabrication techniques, and power management systems may influence the further development and implementation of this technology.

• • Questions about Semiconductor Structure with Power Tap Cells:**

1. How does the use of different sized power vias in power tap cells impact the overall performance of semiconductor structures? 2. What are the potential challenges in integrating orthogonal second power rails with horizontally offset first power rails in semiconductor devices?

Original Abstract Submitted

a semiconductor structure is presented having a plurality of circuit rows, a plurality of first power rails positioned on front sides of the plurality of circuit rows, a plurality of second power rails positioned on back sides of the plurality of circuit rows, and power tap cells associated with each the plurality of circuit rows, wherein each of the power tap cells includes one or more power vias connecting at least one first power rail of the plurality of first power rails to at least one second power rail of the plurality the second power rails. in one instance, the plurality of second power rails are orthogonal to the plurality of first power rails. in another instance, the plurality of first power rails are horizontally offset from the plurality of second power rails. the one or more power vias include at least two or more different sized power vias.