International business machines corporation (20240192439). HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES simplified abstract

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HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES

Organization Name

international business machines corporation

Inventor(s)

Barnim Alexander Janta-polczynski of Shefford (CA)

HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240192439 titled 'HETEROGENEOUS PACKAGE STRUCTURES WITH PHOTONIC DEVICES

The patent application describes heterogeneous package structures with photonic components, including electronic devices, photonic devices, bridge interconnect devices, and optical waveguide devices. The bridge interconnect device connects electronic and photonic devices, while the optical waveguide device forms an optical bus for routing signals.

  • The package structure includes electronic, photonic, bridge interconnect, and optical waveguide devices.
  • The bridge interconnect device connects electronic and photonic devices.
  • The optical waveguide device forms an optical bus for signal routing.
  • The photonic device serves as an electro-optical interface between electronic devices and the optical bus.

Potential Applications

This technology can be applied in telecommunications, data centers, and high-speed computing systems.

Problems Solved

This innovation addresses the need for efficient integration of electronic and photonic components in package structures.

Benefits

The technology enables high-speed data transmission, improved signal integrity, and compact design in electronic systems.

Commercial Applications

Potential commercial applications include telecommunications equipment, data center infrastructure, and high-performance computing devices.

Prior Art

Prior research in integrated photonics and electronic packaging can provide insights into similar approaches to combining photonic and electronic components.

Frequently Updated Research

Ongoing research focuses on enhancing the performance and scalability of heterogeneous package structures with photonic components.

Questions about Heterogeneous Package Structures

What are the key advantages of integrating photonic components in package structures?

Integrating photonic components enables high-speed data transmission and improved signal integrity in electronic systems.

How does the optical waveguide device contribute to signal routing in the package structure?

The optical waveguide device forms an optical bus that efficiently routes optical signals between photonic devices.


Original Abstract Submitted

heterogeneous package structures comprising photonic components are provided. for example, an exemplary package structure comprises at least one electronic device, at least one photonic device, at least one bridge interconnect device, and at least one optical waveguide device. the at least one bridge interconnect device is configured to electrically connect the at least one electronic device to the at least one photonic device. the at least one optical waveguide device is optically coupled to the at least one photonic device to implement an optical bus for routing optical signals in the package structure. the at least one photonic device is configured to implement an electro-optical interface between the at least one electronic device and the optical bus.

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