International business machines corporation (20240186177). ASYMMETRIC SKIP-LEVEL VIA STRUCTURE simplified abstract
Contents
- 1 ASYMMETRIC SKIP-LEVEL VIA STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ASYMMETRIC SKIP-LEVEL VIA STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ASYMMETRIC SKIP-LEVEL VIA STRUCTURE
Organization Name
international business machines corporation
Inventor(s)
Nicholas Anthony Lanzillo of Wynantskill NY (US)
Reinaldo Vega of Mahopac NY (US)
Takashi Ando of Eastchester NY (US)
David Wolpert of Poughkeepsie NY (US)
ASYMMETRIC SKIP-LEVEL VIA STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240186177 titled 'ASYMMETRIC SKIP-LEVEL VIA STRUCTURE
Simplified Explanation
The semiconductor interconnect structure described in the patent application includes a skip via, which consists of a first skip via segment connected vertically to a second skip via segment. The first skip via segment has a certain width, while the second skip via segment has a different width.
- The semiconductor interconnect structure features a skip via design, which improves the efficiency of vertical connections within the structure.
- The skip via consists of two segments with different widths, allowing for more precise control over the interconnect structure.
- This innovation aims to enhance the performance and reliability of semiconductor devices by optimizing the interconnect design.
Potential Applications
The technology described in this patent application could be applied in various semiconductor devices and integrated circuits where efficient vertical connections are crucial.
Problems Solved
This technology addresses the challenges associated with traditional interconnect structures, such as limited control over vertical connections and potential signal interference.
Benefits
The skip via design offers improved performance, reliability, and efficiency in semiconductor interconnect structures. It allows for more precise control over the width of different segments, enhancing the overall functionality of the device.
Potential Commercial Applications
This technology could be utilized in the manufacturing of advanced semiconductor devices, microprocessors, and other electronic components that require optimized interconnect structures.
Possible Prior Art
One possible prior art could be the use of traditional via structures in semiconductor interconnects, which may not offer the same level of control and efficiency as the skip via design described in this patent application.
Unanswered Questions
How does the skip via design impact the overall size and layout of the semiconductor device?
The article does not provide information on how the skip via design affects the overall dimensions and arrangement of the semiconductor interconnect structure.
What manufacturing processes are required to implement the skip via design in semiconductor devices?
The patent application does not detail the specific manufacturing techniques or processes needed to incorporate the skip via design into semiconductor devices.
Original Abstract Submitted
a semiconductor interconnect structure and formation thereof. the semiconductor interconnect structure includes a skip via. the skip via includes a first skip via segment vertically connected to a second skip via segment. the first skip via segment has a first width and the second skip via segment has a second width.
