International business machines corporation (20240180047). PHASE CHANGE MEMORY simplified abstract
Contents
- 1 PHASE CHANGE MEMORY
PHASE CHANGE MEMORY
Organization Name
international business machines corporation
Inventor(s)
Kangguo Cheng of Schenectady NY (US)
Julien Frougier of ALBANY NY (US)
Ruilong Xie of Niskayuna NY (US)
PHASE CHANGE MEMORY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240180047 titled 'PHASE CHANGE MEMORY
Simplified Explanation
The apparatus described in the patent application includes a substrate with two electrodes attached to its upper face, and a bridge of phase-change-memory material connecting the electrodes, which can switch between low and high resistance solid phases.
- The apparatus consists of a substrate with an upper face.
- Two electrodes are attached to the upper face of the substrate.
- A bridge of phase-change-memory material connects the electrodes on the upper face of the substrate.
- The bridge can switch between a low resistance solid phase and a high resistance solid phase.
Potential Applications
This technology could be used in:
- Memory storage devices
- Logic circuits
- Neuromorphic computing systems
Problems Solved
This technology helps in:
- Improving memory storage efficiency
- Enhancing computing speed
- Reducing power consumption in electronic devices
Benefits
The benefits of this technology include:
- Faster data processing
- Lower energy consumption
- Increased reliability of electronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be:
- Data centers
- Consumer electronics
- Automotive electronics
Possible Prior Art
One possible prior art for this technology is the use of phase-change-memory materials in memory storage devices.
Unanswered Questions
How does the thermal switching process affect the overall performance of the apparatus?
The thermal switching process between the low and high resistance solid phases may impact the speed and efficiency of data processing in the apparatus.
What are the potential challenges in scaling up this technology for mass production?
Scaling up this technology for mass production may pose challenges in terms of cost, manufacturing processes, and quality control.
Original Abstract Submitted
an apparatus includes a substrate that has an upper face; a first electrode that is attached to the upper face of the substrate; a second electrode that is attached to the upper face of the substrate at a distance from the first electrode; and a bridge of phase-change-memory material that is attached to and lies along the upper face of the substrate between and electrically connecting the first and second electrodes. at least a portion of the bridge is thermally switchable between a low resistance solid phase and a high resistance solid phase. in some embodiments, the apparatus also includes access devices that are disposed between the electrodes and the substrate, with the bridge being electrically connected between the access devices. at least a portion of the bridge is thermally switchable between a low resistance solid phase and a high resistance solid phase.
