Intel corporation (20250071885). RADIO FREQUENCY FRONT-END STRUCTURES
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RADIO FREQUENCY FRONT-END STRUCTURES
Organization Name
Inventor(s)
Sidharth Dalmia of Portland OR (US)
Zhenguo Jiang of Chandler AZ (US)
William J. Lambert of Chandler AZ (US)
Kirthika Nahalingam of San Jose CA (US)
Swathi Vijayakumar of Folsom CA (US)
RADIO FREQUENCY FRONT-END STRUCTURES
This abstract first appeared for US patent application 20250071885 titled 'RADIO FREQUENCY FRONT-END STRUCTURES
Original Abstract Submitted
disclosed herein are radio frequency (rf) front-end structures, as well as related methods and devices. in some embodiments, an rf front-end package may include an rf package substrate including an embedded passive circuit element. at least a portion of the embedded passive circuit element may be included in a metal layer of the rf package substrate. the rf package substrate may also include a ground plane in the metal layer.
