Intel corporation (20240431061). STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
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STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
Organization Name
Inventor(s)
Alonso Rodriguez Chacon of La Guacima (CR)
Arturo Navarro Alvarez of San Isidro (CR)
STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
This abstract first appeared for US patent application 20240431061 titled 'STANDOFF-SPRING COMBINATION FITTING FOR THERMAL SOLUTIONS
Original Abstract Submitted
example fittings that combine standoffs and springs for supporting thermal solutions are disclosed herein. an example electronic device includes a chassis; a substrate; a thermal solution; and a fitting to separate the substrate from the chassis and to separate the thermal solution from the substrate, the fitting including a standoff end and a spring end.
