Intel corporation (20240413194). THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
Contents
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
Organization Name
Inventor(s)
Denzil Frost of Rio Rancho ID (US)
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
This abstract first appeared for US patent application 20240413194 titled 'THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITORS
Original Abstract Submitted
disclosed herein are ic devices with three-dimensional metal-insulator-metal capacitor structures. an example ic device implementing such capacitor structures includes studs of a first insulator material, an insulator material surrounding and in contact with upper-most portions of sidewalls of the studs, a first electrically conductive material surrounding bottom-most portions of the sidewalls of the studs, and a second electrically conductive material surrounding middle portions of the sidewalls of the studs, wherein the insulator material further surrounds the second electrically conductive material over the middle portions of the sidewalls of the studs. the ic device further includes a third electrically conductive material surrounding the insulator material surrounding the middle portions and the upper-most portions of the studs.
