Intel corporation (20240355750). MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS simplified abstract
Contents
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
Organization Name
Inventor(s)
Adel A. Elsherbini of Tempe AZ (US)
Amr Elshazly of Hillsboro OR (US)
Arun Chandrasekhar of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355750 titled 'MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS
The abstract of this patent application describes a microelectronic assembly that includes multiple dies connected through interconnects, with a communication network partially included in each die to facilitate communication between them.
- Package substrate
- First die coupled to the package substrate with first interconnects
- Second die coupled to the first die with second interconnects
- Communication network partially included in both dies
- Communication pathway between the first and second dies
Potential Applications: - Semiconductor industry - Telecommunications - Consumer electronics
Problems Solved: - Improved communication between microelectronic components - Enhanced functionality and performance of electronic devices
Benefits: - Faster data transfer speeds - More efficient use of space within electronic devices - Enhanced overall performance and reliability
Commercial Applications: - Manufacturing of smartphones, tablets, and other electronic devices - Data centers and server farms - Automotive industry for advanced driver assistance systems
Questions about Microelectronic Assemblies: 1. How does the communication network improve the performance of the microelectronic assembly? 2. What are the potential challenges in integrating multiple dies with communication networks in a compact space?
Frequently Updated Research: - Ongoing advancements in semiconductor technology - Research on improving interconnect technologies for microelectronic assemblies
Original Abstract Submitted
microelectronic assemblies, and related devices and methods, are disclosed herein. for example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
