Intel corporation (20240355641). HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES simplified abstract
Contents
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
Organization Name
Inventor(s)
Sri Chaitra Jyotsna Chavali of Chandler AZ (US)
Siddharth K. Alur of Chandler AZ (US)
Amanda E. Shuckman of Chandler AZ (US)
HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240355641 titled 'HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES
The patent application discusses systems, devices, and methods involving an organic high-density interconnect structure and techniques for its production.
- Forming low-density buildup layers on a core conductive interconnect material
- Connecting the low-density buildup layers to the core material
- Forming high-density buildup layers on exposed low-density layers
- Connecting the high-density layers to the low-density layers
- Adding another low-density buildup layer around exposed high-density layers
Potential Applications: - Electronic devices - Circuit boards - Semiconductor manufacturing
Problems Solved: - Improving interconnect density - Enhancing electrical and mechanical connections
Benefits: - Increased efficiency in electronic devices - Enhanced performance of circuit boards - Improved reliability in semiconductor manufacturing
Commercial Applications: Title: Advanced Interconnect Structures for Electronic Devices This technology can be used in the production of high-performance electronic devices, circuit boards, and semiconductor components. Its high-density interconnect structure offers improved efficiency and reliability, making it ideal for various commercial applications in the electronics industry.
Questions about the technology: 1. How does the high-density interconnect structure improve the performance of electronic devices? - The high-density interconnect structure allows for more efficient and reliable connections between components, leading to enhanced overall performance.
2. What are the key differences between low-density and high-density buildup layers in this technology? - Low-density buildup layers provide a foundation for the interconnect structure, while high-density layers increase the overall density and efficiency of the connections.
Original Abstract Submitted
generally discussed herein are systems, devices, and methods that include an organic high-density interconnect structure and techniques for making the same. according to an example a method can include forming one or more low-density buildup layers on a core, conductive interconnect material of the one or more low-density buildup layers electrically and mechanically connected to conductive interconnect material of the core, forming one or more high-density buildup layers on an exposed low-density buildup layer of the one or more low-density buildup layers, conductive interconnect material of the high-density buildup layers electrically and mechanically connected to the conductive interconnect material of the one or more low-density buildup layers, and forming another low-density buildup layer on and around an exposed high-density buildup layer of the one or more high-density buildup layers.
