Intel corporation (20240345639). FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING simplified abstract
Contents
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
Organization Name
Inventor(s)
Andres Ramirez Macias of Zapopan (MX)
Aardra B. Athalye of Beaverton OR (US)
Devdatta Prakash Kulkarni of Portland OR (US)
Gilberto Rayas Paredes of Zapopan (MX)
Bijoyraj Sahu of Portland OR (US)
FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240345639 titled 'FLEXIBLE AND MODULAR TOP AND BOTTOM SIDE PROCESSOR UNIT MODULE COOLING
Simplified Explanation: The patent application describes a flexible and modular cooling system for processor unit modules, with components on both the top and bottom sides of a printed circuit board.
- The apparatus includes an integrated circuit component on one side of the board and an electronic component on the other side, with a stiffener partially enclosing the board.
- A flexible strap thermally couples the electronic component and a portion of the stiffener to enhance cooling efficiency.
Key Features and Innovation:
- Cooling system for processor unit modules with components on both sides of the printed circuit board.
- Flexible strap for thermal coupling between electronic component and stiffener.
- Modular design for easy installation and maintenance.
Potential Applications:
- Data centers
- High-performance computing
- Industrial control systems
Problems Solved:
- Overheating of electronic components in processor unit modules.
- Inefficient cooling solutions for components on both sides of a printed circuit board.
Benefits:
- Improved thermal management
- Enhanced reliability and performance of electronic components
- Modular and flexible design for easy integration into existing systems
Commercial Applications: Potential commercial applications include:
- Server farms
- Telecommunications infrastructure
- Automotive electronics
Prior Art: Readers can explore prior art related to cooling systems for electronic components in processor unit modules, as well as modular and flexible cooling solutions in the electronics industry.
Frequently Updated Research: Stay informed about the latest advancements in cooling technologies for electronic components in processor unit modules.
Questions about Processor Unit Module Cooling: 1. What are the key benefits of using a flexible and modular cooling system for processor unit modules? 2. How does the thermal coupling between the electronic component and stiffener improve cooling efficiency?
Original Abstract Submitted
flexible and modular top and bottom side processor unit module cooling is disclosed. an example apparatus comprises a printed circuit board including an integrated circuit component on a first side of the printed circuit board, and an electronic component on a second side of the printed circuit board, the second side facing away from the first side; a stiffener to at least partially enclose the printed circuit board, and a flexible strap to thermally couple the electronic component and a portion of the stiffener, the portion of the stiffener positioned adjacent the first side of the printed circuit board.
