Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

Organization Name

intel corporation

Inventor(s)

Aleksandar Aleksov of Chandler AZ (US)

Adel A. Elsherbini of Chandler AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

Johanna M. Swan of Scottsdale AZ (US)

Feras Eid of Chandler AZ (US)

Randy B. Osborne of Beaverton OR (US)

Van H. Le of Beaverton OR (US)

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339410 titled 'DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

The abstract describes microelectronic assemblies that are connected through direct bonding, with components such as organic and inorganic dielectric materials.

• Microelectronic assemblies involve direct bonding of components.
• Components include organic dielectric material in the first microelectronic component.
• Direct bonding region in the second microelectronic component has metal contacts and inorganic dielectric material.
• Third microelectronic component is connected to the first component through wire bonding or solder.

Potential Applications: - Microelectronics industry for compact and efficient electronic devices. - Semiconductor manufacturing for improved performance and reliability.

Problems Solved: - Enhances connectivity and reliability of microelectronic components. - Enables miniaturization of electronic devices.

Benefits: - Improved performance and reliability of microelectronic assemblies. - Enhanced connectivity and miniaturization capabilities.

Commercial Applications: Title: Advanced Microelectronic Assemblies for Enhanced Performance This technology can be applied in the development of high-performance electronic devices such as smartphones, tablets, and wearable technology. It can also be utilized in the automotive industry for advanced driver assistance systems and in aerospace for avionics.

Questions about Microelectronic Assemblies: 1. How do microelectronic assemblies improve the performance of electronic devices?

  - Microelectronic assemblies enhance connectivity and reliability, leading to improved overall performance of electronic devices.

2. What are the key components involved in direct bonding in microelectronic assemblies?

  - The key components include organic and inorganic dielectric materials, metal contacts, and wire bonding or solder for connectivity.

Original Abstract Submitted

disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. for example, in some embodiments, a microelectronic assembly may include a first microelectronic component, including an organic dielectric material; a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes metal contacts and a dielectric material between adjacent ones of the metal contacts, and wherein the dielectric material includes an inorganic dielectric material; and a third microelectronic component coupled to the first microelectronic component by wire bonding or solder.