Intel corporation (20240332127). ON-PACKAGE EMBEDDED COOLING DEVICE simplified abstract
Contents
ON-PACKAGE EMBEDDED COOLING DEVICE
Organization Name
Inventor(s)
Eng Kwong Lee of Bayan Lepas (MY)
Tin Poay Chuah of Bayan Baru (MY)
Chew Ching Lim of Bayan Lepas (MY)
ON-PACKAGE EMBEDDED COOLING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240332127 titled 'ON-PACKAGE EMBEDDED COOLING DEVICE
The integrated circuit package described in the abstract incorporates an integrated heat spreader (IHS) that includes a peltier element, with one or more peltier elements possibly located in the top portion of the IHS. The peltier element(s) are electrically connected to the package substrate through a trace on a sidewall of the IHS.
- The integrated circuit package includes an integrated heat spreader (IHS) with a peltier element.
- The peltier element(s) may be located in the top portion of the IHS.
- The peltier element(s) are electrically connected to the package substrate through a trace on a sidewall of the IHS.
Potential Applications: - Cooling electronic components in integrated circuits - Managing heat dissipation in high-performance computing systems - Enhancing thermal management in electronic devices
Problems Solved: - Efficient heat dissipation in integrated circuits - Improved thermal performance in electronic devices - Enhanced reliability of electronic components
Benefits: - Better temperature control in integrated circuits - Increased longevity of electronic devices - Enhanced overall performance of electronic systems
Commercial Applications: Title: "Advanced Thermal Management Solutions for Integrated Circuits" This technology could be utilized in high-performance computing systems, data centers, telecommunications equipment, and automotive electronics to improve thermal management and overall system performance.
Questions about Integrated Circuit Package with Peltier Element: 1. How does the integration of a peltier element in the heat spreader improve thermal management in electronic devices? 2. What are the potential challenges associated with implementing peltier elements in integrated circuit packages?
Original Abstract Submitted
in one embodiment, an integrated circuit package includes an integrated heat spreader (ihs) that incorporates a peltier element. the ihs may include one or more peltier elements, which may be in a top portion of the ihs. the peltier element(s) may be electrically connected to the package substrate through a trace on a sidewall of the ihs.
