Intel corporation (20240331921). ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS simplified abstract

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

Organization Name

intel corporation

Inventor(s)

Benjamin Duong of Phoenix AZ (US)

Michael Garelick of Chandler AZ (US)

Darko Grujicic of Chandler AZ (US)

Tarek Ibrahim of Mesa AZ (US)

Brandon C. Marin of Chandler AZ (US)

Sai Vadlamani of Chandler AZ (US)

Marcel Wall of Phoenix AZ (US)

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240331921 titled 'ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

The abstract describes a method of fabricating an electronic substrate with an inductor that includes a magnetic material layer and a barrier layer to prevent leaching during fabrication.

• The inductor in the electronic substrate includes a magnetic material layer and a barrier layer.
• The barrier layer prevents the magnetic material from leaching into plating solutions during fabrication.
• The barrier material can be titanium, a polymeric material, or a nitride material layer.
• The inductor also includes a plating seed layer and a conductive fill material.

Potential Applications: - This technology can be used in the manufacturing of electronic devices such as sensors, antennas, and RFID tags. - It can also be applied in the production of communication devices and power electronics.

Problems Solved: - Prevents leaching of magnetic material into plating solutions during fabrication. - Ensures the integrity and functionality of the inductor in the electronic substrate.

Benefits: - Improved manufacturing process efficiency. - Enhanced performance and reliability of electronic devices. - Cost-effective production of electronic substrates.

Commercial Applications: - This technology can be utilized in the electronics industry for the mass production of various electronic components. - It can also find applications in the automotive sector for the development of advanced electronic systems.

Questions about the technology: 1. How does the barrier layer prevent the leaching of the magnetic material during fabrication? 2. What are the specific advantages of using different types of barrier materials in the inductor of the electronic substrate?

Frequently Updated Research: - Stay updated on advancements in barrier materials for electronic substrates to enhance the performance and durability of inductors.

Original Abstract Submitted

an electronic substrate may be fabricated by forming a base substrate and forming an inductor extending through the base substrate, wherein the inductor includes a magnetic material layer and a barrier layer, such that the barrier layer prevents the magnetic material layer from leaching into plating solutions during the fabrication of the electronic substrate. in one embodiment, the barrier material may comprise titanium. in another embodiment, the barrier layer may comprise a polymeric material. in still another embodiment, the barrier layer may comprise a nitride material layer. the inductor may further include a plating seed layer on the barrier layer and a conductive fill material abutting the plating seed layer.