Intel corporation (20240329301). EMBEDDED PHOTONIC INTEGRATED CIRCUITS simplified abstract
Contents
EMBEDDED PHOTONIC INTEGRATED CIRCUITS
Organization Name
Inventor(s)
Kaveh Hosseini of Livermore CA (US)
Ravindranath V. Mahajan of Chandler AZ (US)
Chia-Pin Chiu of Tempe AZ (US)
EMBEDDED PHOTONIC INTEGRATED CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240329301 titled 'EMBEDDED PHOTONIC INTEGRATED CIRCUITS
The abstract describes a substrate for a multi-chip package that includes photonic integrated circuit (PIC) interposers mounted in a cavity on a surface, each configured to connect with integrated circuit devices and optical couplers.
- The substrate includes PIC interposers that can electrically connect with or optically couple to multiple integrated circuit devices.
- The substrate also features optical couplers that are optically coupled to the PIC interposers.
- The PIC interposers are mounted in a cavity on a major surface of the substrate.
- The substrate is designed to facilitate the integration of multiple chips in a package.
- The optical couplers enhance the optical connectivity of the PIC interposers.
Potential Applications: - Data centers - Telecommunications networks - High-performance computing systems
Problems Solved: - Improved connectivity between integrated circuit devices - Enhanced optical coupling capabilities - Efficient integration of multiple chips in a package
Benefits: - Increased data transfer speeds - Enhanced optical communication - Space-saving design for compact electronic devices
Commercial Applications: Title: "Optical Substrate for Multi-Chip Packages: Enhancing Connectivity and Integration" This technology can be used in various commercial applications such as data centers, telecommunications networks, and high-performance computing systems. The enhanced connectivity and integration capabilities of the substrate make it ideal for optimizing data transfer speeds and improving optical communication in electronic devices.
Questions about the technology: 1. How does the optical coupling of the PIC interposers improve connectivity in the substrate? 2. What are the potential advantages of using this substrate in data centers or telecommunications networks?
Original Abstract Submitted
a substrate for a multi-chip package includes at least one photonic integrated circuit (pic) interposer mounted in a cavity in a first major surface. each pic interposer is configured to electrically connect with, or optically couple to, a plurality of integrated circuit devices. the substrate further includes at least one optical coupler that is optically coupled to the pic interposer.
