Intel corporation (20240324144). COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES simplified abstract
Contents
COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES
Organization Name
Inventor(s)
Juha Tapani Paavola of Hillsboro OR (US)
Christopher Moore of Warren OR (US)
Prakash Kurma Raju of Bangalore (IN)
COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240324144 titled 'COOLING SYSTEMS WITH HEAT PIPES FOR ELECTRONIC DEVICES
The abstract of this patent application describes cooling systems with heat pipes for electronic devices. A cooling system includes a heat pipe with a top wall and a bottom wall, containing a fluid. The system also includes a wick and a stiffener coupled to the wick, which contacts both walls of the heat pipe.
- Heat pipe with top and bottom walls
- Contains fluid
- Wick and stiffener for cooling
- Stiffener contacts top and bottom walls
Potential Applications: - Cooling systems for electronic devices - Thermal management in computers and servers - Heat dissipation in LED lighting systems
Problems Solved: - Overheating of electronic devices - Efficient heat transfer - Improved thermal performance
Benefits: - Enhanced cooling efficiency - Increased device reliability - Extended lifespan of electronic components
Commercial Applications: Title: Advanced Cooling Systems for Electronics This technology can be used in various industries such as: - Consumer electronics - Automotive electronics - Aerospace applications
Prior Art: Readers can explore prior patents related to heat pipe cooling systems and thermal management in electronic devices to understand the existing technology landscape.
Frequently Updated Research: Stay updated on the latest advancements in heat pipe technology, thermal management solutions, and cooling systems for electronic devices.
Questions about Heat Pipe Cooling Systems: 1. How do heat pipes improve thermal management in electronic devices? Heat pipes efficiently transfer heat away from electronic components, preventing overheating and ensuring optimal performance.
2. What are the key advantages of using a wick and stiffener in a heat pipe cooling system? The wick helps in the capillary action of the fluid, while the stiffener provides structural support and ensures uniform contact with the heat pipe walls.
Original Abstract Submitted
cooling systems with heat pipes for electronic devices are disclosed herein. an example cooling system includes a heat pipe having a top wall and a bottom wall. the heat pipe contains a fluid. the cooling system includes a wick disposed in the heat pipe and a stiffener coupled to the wick. the stiffener contacts the top wall and the bottom wall of the heat pipe.
