Intel corporation (20240324108). ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT simplified abstract
Contents
ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT
Organization Name
Inventor(s)
Juha T. Paavola of Hillsboro OR (US)
ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240324108 titled 'ARCHITECTURES AND METHODS THAT ENABLE A REWORKABLE HEAT MANAGEMENT COMPONENT
The abstract of the patent application describes architectures and methods for a reworkable heat management component. A "debonding film" is deposited in cooperation with an adhesive to provide reworkable ("peelable") heat management solutions for a variety of heat management components and IC components.
- The innovation involves the use of a debonding film in conjunction with an adhesive to create reworkable heat management solutions.
- This technology allows for easy removal and replacement of heat management components without damaging the underlying components.
- The debonding film provides a peelable solution for heat management in a wide range of applications, including IC components.
- By enabling reworkability, this innovation offers flexibility and cost-effectiveness in managing heat in electronic devices.
- The combination of the debonding film and adhesive provides a reliable and efficient solution for heat management challenges.
Potential Applications: - Electronic devices - Automotive systems - Industrial machinery - Aerospace applications
Problems Solved: - Difficulty in replacing heat management components - Risk of damage to underlying components during heat management maintenance - Lack of flexibility in heat management solutions
Benefits: - Easy removal and replacement of heat management components - Cost-effective maintenance of heat management systems - Enhanced flexibility in managing heat in electronic devices
Commercial Applications: Title: Reworkable Heat Management Solutions for Electronic Devices This technology can be applied in various industries such as electronics manufacturing, automotive, aerospace, and industrial sectors. It offers a cost-effective and efficient solution for managing heat in electronic devices, leading to improved performance and longevity.
Questions about Reworkable Heat Management Solutions: 1. How does the debonding film work in conjunction with the adhesive to provide reworkable heat management solutions? The debonding film is deposited along with the adhesive to create a peelable layer that allows for easy removal of heat management components without causing damage to the underlying components.
2. What are the potential applications of this technology beyond electronic devices? This technology can also be applied in automotive systems, industrial machinery, and aerospace applications where reworkable heat management solutions are needed.
Original Abstract Submitted
architectures and methods for a reworkable heat management component. a “debonding film” is deposited in cooperation with an adhesive to provide reworkable (“peelable”) heat management solutions for a variety of heat management components and ic components.
