Intel corporation (20240322775). THREE-DIMENSIONAL POWER COMBINERS simplified abstract
Contents
THREE-DIMENSIONAL POWER COMBINERS
Organization Name
Inventor(s)
Telesphor Kamgaing of Chandler AZ (US)
Peter Baumgartner of Munich (DE)
Steven Callender of Denver CO (US)
Harald Gossner of Riemerling (DE)
Jonathan Jensen of Portland OR (US)
THREE-DIMENSIONAL POWER COMBINERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240322775 titled 'THREE-DIMENSIONAL POWER COMBINERS
The abstract describes electronic assemblies, integrated circuit packages, and communication devices implementing three-dimensional power combiners. An electronic assembly consists of a first die with a first transmission line and a second die with a second transmission line, stacked on top of each other. The assembly includes conductive pathways connecting the transmission lines to connection points on the dies.
- Electronic assemblies, IC packages, and communication devices implement three-dimensional power combiners.
- Each die in the assembly has a transmission line and is stacked above another die with a transmission line.
- Conductive pathways connect the transmission lines to connection points on the dies.
- The technology enables efficient power combining in electronic systems.
- Improved signal transmission and power management are achieved through this innovation.
Potential Applications: - Telecommunications equipment - Radar systems - Satellite communication devices
Problems Solved: - Enhanced power combining efficiency - Improved signal transmission - Better power management in electronic systems
Benefits: - Increased performance in communication devices - Higher efficiency in power management - Improved signal quality
Commercial Applications: Title: Three-Dimensional Power Combiners for Enhanced Communication Systems This technology can be utilized in telecommunications equipment, radar systems, and satellite communication devices, improving their performance and efficiency in signal transmission and power management.
Prior Art: Readers can explore prior research on power combiners, transmission line technologies, and integrated circuit packaging to understand the background of this innovation.
Frequently Updated Research: Researchers are continually exploring advancements in power combining techniques and transmission line technologies to enhance the efficiency and performance of communication devices.
Questions about Three-Dimensional Power Combiners: 1. How does this technology improve signal transmission in communication devices? 2. What are the potential applications of three-dimensional power combiners in radar systems?
Original Abstract Submitted
disclosed herein are electronic assemblies, integrated circuit (ic) packages, and communication devices implementing three-dimensional power combiners. an electronic assembly may include a first die, comprising a first transmission line, and a second die, comprising a second transmission line. each die includes a first face and an opposing second face, and the second die is stacked above the first die so that the first face of the second die is coupled to the second face of the first die. the electronic assembly further includes a first conductive pathway between one end of the first transmission line and a first connection point at the first face of the first die, a second conductive pathway between one end of the second transmission line and a second connection point at the first face of the first die, and a third conductive pathway between the other ends of the first and second transmission lines.
