Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
Contents
- 1 HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Organic Bridges for Multi-Chip Interconnects
- 1.13 Original Abstract Submitted
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
Organization Name
Inventor(s)
Mihir K. Roy of Chandler AZ (US)
Stefanie M. Lotz of Phoenix AZ (US)
Wei-Lun Kane Jen of Phoenix AZ (US)
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321762 titled 'HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
Simplified Explanation
Embodiments of a patent application describe the use of organic bridges for multi-chip interconnects. These bridges are embedded in an organic package substrate and allow for the attachment of interconnected die.
- Organic bridges with interconnect structures facilitate die attachment.
- Organic bridges may include metal routing and pad layers, as well as organic polymer dielectric layers.
- Some embodiments embed the bridges in the top layers of the substrate.
- Methods of manufacture for these organic bridges are also detailed.
Key Features and Innovation
- Use of organic bridges for multi-chip interconnects.
- Embedded organic bridges in package substrates.
- Metal routing and pad layers in organic bridges.
- Interleaved organic polymer dielectric layers.
- Manufacture methods for organic bridges.
Potential Applications
The technology could be applied in:
- Semiconductor industry for chip interconnects.
- Electronics manufacturing for compact and efficient designs.
- IoT devices for improved connectivity.
Problems Solved
- Facilitates interconnection of multiple chips.
- Enables compact and efficient packaging.
- Enhances connectivity in electronic devices.
Benefits
- Improved chip interconnectivity.
- Compact and efficient design options.
- Enhanced performance in electronic devices.
Commercial Applications
Organic Bridges for Multi-Chip Interconnects
This technology could revolutionize the semiconductor and electronics industries by offering a more efficient and compact solution for chip interconnects. The market implications include faster production processes, reduced costs, and improved device performance.
Prior Art
Readers interested in prior art related to this technology could explore research on organic interconnects, multi-chip packaging, and semiconductor manufacturing processes.
Frequently Updated Research
Stay updated on the latest advancements in organic interconnect technologies, multi-chip packaging methods, and semiconductor industry trends to understand the evolving landscape of this innovative technology.
Questions about Organic Bridges for Multi-Chip Interconnects
What are the potential challenges in integrating organic bridges into existing semiconductor manufacturing processes?
Integrating organic bridges into traditional semiconductor manufacturing processes may pose challenges related to compatibility, reliability, and scalability. Research and development efforts are likely focused on addressing these issues to ensure seamless integration.
How do organic bridges compare to traditional interconnect technologies in terms of performance and cost-efficiency?
Organic bridges offer potential advantages in terms of performance and cost-efficiency compared to traditional interconnect technologies. Research and testing are essential to validate these benefits and optimize the technology for commercial applications.
Original Abstract Submitted
embodiments that allow multi-chip interconnect using organic bridges are described. in some embodiments an organic package substrate has an embedded organic bridge. the organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. in some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. methods of manufacture are also described.
