Intel corporation (20240321656). GLASS CORE SUBSTRATE WITH LGA NOTCH simplified abstract
Contents
GLASS CORE SUBSTRATE WITH LGA NOTCH
Organization Name
Inventor(s)
Aaron Garelick of Chandler AZ (US)
Brandon C. Marin of Gilbert AZ (US)
Srinivas V. Pietambaram of Chandler AZ (US)
GLASS CORE SUBSTRATE WITH LGA NOTCH - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240321656 titled 'GLASS CORE SUBSTRATE WITH LGA NOTCH
Simplified Explanation: The patent application describes package substrates with a core made of glass and an insert of a different material within the core. Notches are provided through layers above and below the core, passing through the insert as well.
Key Features and Innovation:
- Package substrate with a glass core and a different material insert.
- Notches passing through layers and the insert within the core.
Potential Applications: This technology could be used in electronic packaging, semiconductor devices, and other industries requiring durable and customizable substrates.
Problems Solved: This innovation addresses the need for strong and versatile package substrates that can accommodate different materials within the core.
Benefits:
- Enhanced durability and customization options for package substrates.
- Improved functionality and performance in electronic and semiconductor applications.
Commercial Applications: The technology could be applied in the manufacturing of electronic components, semiconductor devices, and other industries requiring advanced packaging solutions.
Questions about Package Substrates: 1. How does the use of different materials in the core and insert benefit the overall performance of the package substrate? 2. What are the potential challenges in manufacturing package substrates with notches passing through layers and inserts?
Frequently Updated Research: Stay informed about the latest developments in package substrate technology to ensure optimal performance and compatibility with various applications.
Original Abstract Submitted
embodiments disclosed herein include package substrates. in an embodiment, the package substrate comprises a core, where the core comprises glass, and an insert in the core. in an embodiment, the insert is a different material than the core. in an embodiment, a first layer is over the core and a second layer is under the core. in an embodiment, a notch is provided through the first layer, the core, and the second layer. in an embodiment, the notch passes through the insert in the core.
