Intel corporation (20240319437). PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN simplified abstract
Contents
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
Organization Name
Inventor(s)
Xiaoqian Li of Chandler AZ (US)
Omkar G. Karhade of Chandler AZ (US)
Nitin A. Deshpande of Chandler AZ (US)
Julia Chiu of Portland OR (US)
Chia-Pin Chiu of Tempe AZ (US)
Kaveh Hosseini of Livermore CA (US)
Madhubanti Chatterjee of Portland OR (US)
PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240319437 titled 'PHOTONIC INTEGRATED CIRCUIT DEFINING TRENCHES THEREIN
Simplified Explanation: The patent application describes a photonic integrated circuit (PIC) with a semiconductor layer on top of a PIC substrate, which includes an optical component and an air cavity. The semiconductor layer does not have any openings communicating with the air cavity.
Key Features and Innovation:
- Photonic integrated circuit (PIC) with a semiconductor layer on top of a PIC substrate
- Semiconductor layer includes an optical component and is free of any openings communicating with an air cavity
- Enhanced integration of optical components in a compact structure
Potential Applications: The technology can be used in:
- Telecommunications
- Data centers
- Optical networking
- Sensing applications
Problems Solved:
- Improved integration of optical components
- Enhanced performance and reliability of photonic integrated circuits
- Reduction in size and complexity of optical systems
Benefits:
- Higher efficiency in optical communication systems
- Compact and reliable design
- Cost-effective manufacturing process
Commercial Applications: The technology can be applied in:
- Fiber optic communication systems
- High-speed data transmission
- Optical sensors market
Questions about Photonic Integrated Circuit Technology: 1. How does the absence of openings in the semiconductor layer benefit the performance of the photonic integrated circuit? 2. What are the potential challenges in manufacturing and scaling up the production of these advanced photonic integrated circuits?
Frequently Updated Research: Ongoing research focuses on improving the efficiency and scalability of photonic integrated circuits for various applications in telecommunications and data transmission.
Original Abstract Submitted
a photonic integrated circuit (pic), a semiconductor assembly including the pic, a multi-chip package including the pic, and a method of forming the pic. the pic includes a pic substrate, and a semiconductor layer on a top surface of the pic substrate and including a semiconductor material and an optical component. the pic substrate defines an air cavity therein extending in a direction from a bottom surface of the pic substrate toward and in registration with the optical component. the semiconductor layer is free of any opening therethrough in communication with the air cavity.
