Intel corporation (20240290680). LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME simplified abstract
Contents
LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME
Organization Name
Inventor(s)
Poh Boon Khoo of Bayan Lepas (MY)
LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290680 titled 'LOW-PROFILE MEMORY APPARATUS COMPATIBLE WITH SYSTEM THERMAL SOLUTIONS AND METHOD FOR MAKING SAME
Simplified Explanation:
This patent application describes a memory apparatus that is designed to be compatible with system thermal solutions. The apparatus includes a substrate layer with conductive contacts, a memory package attached to these contacts, and a heat spreader component to manage heat dissipation.
- The memory apparatus is low-profile and can be easily integrated into systems with thermal constraints.
- The memory package is inverted and attached to conductive contacts on the substrate layer.
- A heat spreader component with a cavity is included to help dissipate heat generated by the memory package.
- Additional conductive contacts on the substrate layer allow for connection to other substrates or printed circuit boards in a multi-die assembly.
- The design of the apparatus ensures efficient heat management while maintaining compatibility with existing system thermal solutions.
Potential Applications: The memory apparatus can be used in various electronic devices where space and thermal management are critical, such as laptops, tablets, and servers.
Problems Solved: This technology addresses the challenge of integrating memory components into systems with limited space and thermal constraints without compromising performance.
Benefits: The memory apparatus allows for efficient heat dissipation, enabling reliable performance in compact electronic devices. It also simplifies the integration of memory components into multi-die assemblies.
Commercial Applications: This memory apparatus could be valuable in the consumer electronics industry, particularly for manufacturers looking to enhance the performance and reliability of their products in a space-constrained environment.
Prior Art: Readers interested in prior art related to this technology could explore patents or research papers on memory module design, thermal management in electronic devices, and multi-die assembly techniques.
Frequently Updated Research: Researchers may be conducting studies on advanced thermal management techniques for memory modules or exploring innovative designs for low-profile memory solutions.
Questions about Memory Apparatus: 1. How does the memory apparatus manage heat dissipation effectively? 2. What are the potential challenges in integrating this memory apparatus into existing electronic systems?
Original Abstract Submitted
a low-profile memory apparatus that is compatible with system thermal solutions. the apparatus includes a substrate layer with an upper surface and a lower surface, a portion of the substrate layer having a first arrangement of conductive contacts located on the lower surface. a memory package is inverted and attached to the first arrangement of conductive contacts. a heat spreader component comprising a cavity is included. the memory package and the portion of the substrate layer having the first arrangement of conductive contacts located in the cavity. a second arrangement of conductive contacts is located on the lower surface of the substrate layer, external to the heat spreader component, to attach the apparatus to another substrate or printed circuit board in a multi-die assembly.
