Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract
Contents
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Chandler AZ (US)
Aleksandar Aleksov of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240274576 titled 'DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES
The abstract of this patent application describes microelectronic assemblies that utilize direct bonding between components, with non-uniformly distributed metal contacts.
- Direct bonding between microelectronic components
- Non-uniform distribution of metal contacts in the bonding region
- First metal contact with larger area than second metal contact
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Electronic device production
Problems Solved: - Enhanced bonding between components - Improved electrical connectivity - Increased reliability of microelectronic assemblies
Benefits: - Higher performance in microelectronic devices - Greater durability and longevity - Enhanced overall functionality
Commercial Applications: Title: Advanced Microelectronic Assembly Technology for Improved Device Performance This technology can be applied in the production of various electronic devices, such as smartphones, computers, and medical equipment, to enhance their performance and reliability in the market.
Questions about the technology: 1. How does the non-uniform distribution of metal contacts in the bonding region improve the performance of microelectronic assemblies? 2. What are the specific advantages of direct bonding between microelectronic components compared to other bonding techniques?
Original Abstract Submitted
disclosed herein are microelectronic assemblies including direct bonding, as well as related structures and techniques. for example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region including metal contacts that are distributed non-uniformly. in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes a first metal contact and a second metal contact, the first metal contact has a larger area than the second metal contact.
