Intel corporation (20240274542). COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME simplified abstract

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COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

Organization Name

intel corporation

Inventor(s)

Adel Elsherbini of Tempe AZ (US)

Shawna Liff of Scottsdale AZ (US)

Johanna Swan of Scottsdale AZ (US)

Gerald Pasdast of San Jose CA (US)

COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240274542 titled 'COMPOSITE INTERPOSER STRUCTURE AND METHOD OF PROVIDING SAME

Simplified Explanation: The patent application discusses techniques and mechanisms for high interconnect density communication using an interposer. The interposer includes inorganic dielectrics that adjoin each other at a material interface, enabling connections between different hardware interfaces on the interposer.

  • The interposer consists of a substrate with portions that have inorganic dielectrics adjoining each other at a material interface.
  • Hardware interfaces on the interposer allow for connections between different sides of the interposer using interconnects.
  • The metallization pitch feature of the hardware interfaces can vary, with smaller pitches on certain interfaces.

Key Features and Innovation:

  • High interconnect density communication using an interposer with inorganic dielectrics.
  • Hardware interfaces on the interposer facilitate connections between different sides.
  • Varying metallization pitch features on different hardware interfaces.

Potential Applications:

  • High-performance computing systems
  • Data centers
  • Networking equipment

Problems Solved:

  • Increasing interconnect density in communication systems
  • Facilitating connections between different hardware interfaces

Benefits:

  • Improved communication efficiency
  • Enhanced performance in high-speed data transfer
  • Space-saving design for compact electronic devices

Commercial Applications: High-Density Interconnect Technology for Advanced Computing Systems

Questions about High Interconnect Density Communication with an Interposer: 1. How does the use of inorganic dielectrics improve interconnect density in communication systems? 2. What are the potential challenges in implementing high interconnect density communication with an interposer?


Original Abstract Submitted

techniques and mechanisms for high interconnect density communication with an interposer. in some embodiments, an interposer comprises a substrate and portions disposed thereon, wherein respective inorganic dielectrics of said portions adjoin each other at a material interface, which extends to each of the substrate and a first side of the interposer. a first hardware interface of the interposer spans the material interface at the first side, wherein a first one of said portions comprises first interconnects which couple the first hardware interface to a second hardware interface at the first side. a second one of said portions includes second interconnects which couple one of first hardware interface or the second hardware interface to a third hardware interface at another side of the interposer. in another embodiment, a metallization pitch feature of the first hardware interface is smaller than a corresponding metallization pitch feature of the second hardware interface.

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