Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES simplified abstract
Contents
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Chandler AZ (US)
Georgios Dogiamis of Chandler AZ (US)
Shawna M. Liff of Scottsdale AZ (US)
Zhiguo Qian of Chandler AZ (US)
Johanna M. Swan of Scottsdale AZ (US)
MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258296 titled 'MICROELECTRONIC ASSEMBLIES
The abstract of this patent application describes a microelectronic assembly consisting of multiple layers and components, including dielectric layers, conductive pillars, and a radio frequency shield structure.
- Package substrate with a surface
- First die with first and second surfaces in a dielectric layer
- Second die with first and second surfaces in a dielectric layer
- Third die with first and second surfaces in a dielectric layer
- Conductive pillar coupling the third die to the package substrate
- Conductive, radio frequency shield structure surrounding the conductive pillar
Potential Applications: - Advanced electronic devices - High-frequency communication systems - Aerospace technology
Problems Solved: - Enhanced signal integrity - Improved thermal management - Increased reliability of microelectronic assemblies
Benefits: - Higher performance capabilities - Reduced electromagnetic interference - Enhanced durability and longevity
Commercial Applications: Title: "Innovative Microelectronic Assembly for High-Performance Devices" This technology could be utilized in the development of cutting-edge electronic devices, particularly in industries requiring high-frequency communication and reliable signal processing. The market implications include improved product quality, increased efficiency, and expanded capabilities in various sectors such as telecommunications, aerospace, and defense.
Questions about Microelectronic Assemblies: 1. How does the conductive pillar contribute to the overall functionality of the microelectronic assembly? The conductive pillar plays a crucial role in establishing a stable connection between the third die and the package substrate, ensuring efficient signal transmission and structural integrity.
2. What are the key advantages of using a radio frequency shield structure in this microelectronic assembly? The radio frequency shield structure helps to minimize electromagnetic interference, enhance signal clarity, and improve the overall performance of the assembly in high-frequency communication systems.
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a package substrate having a surface; a first die, having opposing first and second surfaces, in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the surface of the package substrate, and the first surface of the first die is coupled to the surface of the package substrate; a second die, having opposing first and second surfaces, in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer; a third die, having opposing first and second surfaces, in the third dielectric layer, wherein the first surface of the third die is coupled to the surface of the package substrate by a conductive pillar; and a conductive, radio frequency shield structure surrounding the conductive pillar.
