Intel corporation (20240258240). DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE simplified abstract
Contents
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
Organization Name
Inventor(s)
Robert Alan May of Chandler AZ (US)
Wei-Lun Kane Jen of Chandler AZ (US)
Jonathan L. Rosch of Mesa AZ (US)
Islam A. Salama of Scottsdale AZ (US)
Kristof Darmawikarta of Chandler AZ (US)
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240258240 titled 'DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
Simplified Explanation: The patent application describes a device and method for creating enhanced bridge structures using conducting and insulating layers, with ultra-fine line space (UFLS) routing, to connect dies to the bridge.
Key Features and Innovation:
- Depositing and lithographically processing conducting and insulating layers.
- Utilizing UFLS routing in conducting layers.
- Placing dies on the bridge with UFLS contacts and connecting them through UFLS routing.
- Forming layers after placing the bridge for core-based structures.
- Forming layers over the bridge and carrier for coreless structures.
Potential Applications: The technology can be applied in the semiconductor industry for creating advanced bridge structures in integrated circuits, microprocessors, and other electronic devices.
Problems Solved: This technology addresses the need for improved bridge structures with efficient routing and connections in semiconductor devices.
Benefits:
- Enhanced performance and reliability of electronic devices.
- Improved efficiency in manufacturing processes.
- Increased miniaturization and integration capabilities.
Commercial Applications: The technology can be utilized by semiconductor manufacturers to enhance the design and functionality of their products, leading to improved performance and competitiveness in the market.
Prior Art: Readers can explore prior patents related to bridge structures, UFLS routing, and semiconductor device manufacturing processes to gain a deeper understanding of the technology's background and evolution.
Frequently Updated Research: Stay updated on the latest advancements in bridge structure design, UFLS routing techniques, and semiconductor manufacturing processes to leverage the most current innovations in the field.
Questions about Bridge Structures: 1. What are the key advantages of using UFLS routing in conducting layers for bridge structures? 2. How does the technology for core-based structures differ from that of coreless structures in terms of layer formation and die bonding?
Original Abstract Submitted
a device and method for providing enhanced bridge structures is disclosed. a set of conducting and insulating layers are deposited and lithographically processed. the conducting layers have ufls routing. a bridge with ufls contacts and die disposed on the underlying structure such that the die are connected with the ufls contacts and ufls routing. for core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. for coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.
