Intel corporation (20240243088). COPPERLESS REGIONS TO CONTROL PLATING GROWTH simplified abstract
Contents
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
Organization Name
Inventor(s)
Brandon C. Marin of Gilbert AZ (US)
Jung Kyu Han of Chandler AZ (US)
Rahul Manepalli of Chandler AZ (US)
Srinivas Pietambaram of Chandler AZ (US)
Jacob Vehonsky of Gilbert AZ (US)
COPPERLESS REGIONS TO CONTROL PLATING GROWTH - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243088 titled 'COPPERLESS REGIONS TO CONTROL PLATING GROWTH
The patent application relates to manufacturing a package with a substrate, a copper layer, and bumps on one side of the substrate.
- The package includes a substrate with a copper layer coupled with a first region on one side and bumps on the same region.
- The layout of other regions on the substrate varies the growth of bumps during a plating process by modifying local copper density.
- This innovation allows for precise control over the plating process, improving the quality and reliability of the package.
Potential Applications:
- Semiconductor packaging
- Electronics manufacturing
- Microelectronics industry
Problems Solved:
- Inconsistent bump growth during plating processes
- Lack of control over copper density in different regions of the substrate
Benefits:
- Enhanced quality and reliability of packages
- Improved performance of electronic devices
- Cost-effective manufacturing process
Commercial Applications:
- Semiconductor companies
- Electronics manufacturers
- Microelectronics packaging companies
Questions about the Technology: 1. How does the variation in copper density affect the growth of bumps during the plating process? 2. What are the advantages of controlling the local copper density in different regions of the substrate?
Frequently Updated Research: Research on advanced plating techniques in semiconductor packaging industry.
Original Abstract Submitted
embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to manufacturing a package having a substrate with a first side and a second side opposite the first side, where a copper layer is coupled with a first region of the first side of the substrate and includes a plurality of bumps coupled with the first region of the first side of the substrate where one or more second regions on the first side of the substrate not coupled with a copper layer, and where a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a local copper density of each of the plurality of bumps.
