Intel corporation (20240243087). METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW simplified abstract

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW

Organization Name

intel corporation

Inventor(s)

Ryan Joseph Carrazzone of Chandler AZ (US)

Anastasia Arrington of Queen Creek AZ (US)

Haobo Chen of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Catherine Ka-Yan Mau of Phoenix AZ (US)

Kyle Matthew Mcelhinny of Tempe AZ (US)

Dingying Xu of Chandler AZ (US)

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240243087 titled 'METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER REFLOW

Simplified Explanation: The patent application discloses systems, apparatus, articles of manufacture, and methods to reduce variation in height of bumps after flow in an integrated circuit package.

Key Features and Innovation:

• The apparatus includes a substrate with multiple bumps of varying sizes and thicknesses.
• The bumps are made of solder and are placed on metal pads on the substrate.
• The innovation lies in the precise control of the width and thickness of the metal pads to reduce height variation in the bumps.

Potential Applications: This technology can be applied in the manufacturing of integrated circuit packages to ensure uniformity in bump height, which is crucial for proper functioning of the circuits.

Problems Solved: This technology addresses the issue of variation in bump height after flow, which can lead to performance issues in integrated circuits.

Benefits:

• Improved reliability and performance of integrated circuit packages.
• Enhanced quality control in manufacturing processes.
• Consistent bump height for better electrical connections.

Commercial Applications: Potential commercial applications include the semiconductor industry for the production of high-quality integrated circuit packages with precise bump heights.

Prior Art: Readers can explore prior research on solder bump formation and integrated circuit packaging processes to understand the background of this technology.

Frequently Updated Research: Stay updated on advancements in solder bump technology and integrated circuit packaging processes to enhance the efficiency and reliability of electronic devices.

Questions about the Technology: 1. What are the specific challenges in controlling bump height variation in integrated circuit packages? 2. How does the innovation in this patent application contribute to improving the performance of electronic devices?

Original Abstract Submitted

systems, apparatus, articles of manufacture, and methods to reduce variation in height of bumps after flow are disclosed. an example apparatus includes a substrate of an integrated circuit package, a first bump on the substrate, a second bump on the substrate, and a third bump on the substrate. the first bump includes first solder on a first metal pad. the first metal pad has a first width and a first thickness. the second bump includes second solder on a second metal pad. the second metal pad has a second width and a second thickness. the second width is less than the first width. the second thickness matches the first thickness. the third bump includes third solder on a third metal pad. the third metal pad has a third width. the third width less than the second width.