Intel corporation (20240243066). LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING simplified abstract

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

Organization Name

intel corporation

Inventor(s)

Kristof Darmawikarta of Chandler AZ (US)

Hiroki Tanaka of GILBERT AZ (US)

Robert May of Chandler AZ (US)

Sameer Paital of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Jesse Jones of Chandler AZ (US)

Chung Kwang Christopher Tan of Chandler AZ (US)

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240243066 titled 'LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

The abstract describes an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of manufacturing such packages. It involves layers of organic material, a cavity exposing a surface, a bridge substrate in the cavity, and dies electrically coupled to the bridge substrate.

• Electronic package with embedded multi-interconnect bridge (EMIB)
• Layers of organic material forming the package
• Cavity exposing a surface for bridge substrate placement
• Bridge substrate supporting dies electrically coupled to it
• First die connected to a first contact on the bridge substrate
• Second die connected to a second contact on the bridge substrate

Potential Applications: - Advanced electronic devices - High-performance computing systems - Communication equipment - Aerospace and defense technology - Automotive electronics

Problems Solved: - Enhanced electrical connectivity - Improved signal transmission - Space-saving design - Increased reliability and performance

Benefits: - Higher efficiency in electronic systems - Compact and lightweight package design - Improved signal integrity - Cost-effective manufacturing process

Commercial Applications: Title: Advanced Electronic Packaging Technology for High-Performance Devices This technology can be utilized in various industries such as telecommunications, automotive, aerospace, and consumer electronics. It offers a competitive edge in developing cutting-edge electronic devices with improved performance and reliability.

Questions about Electronic Packaging Technology: 1. How does the embedded multi-interconnect bridge (EMIB) enhance signal transmission in electronic packages? 2. What are the key advantages of using organic material layers in electronic packaging technology?

Original Abstract Submitted

embodiments include an electronic package with an embedded multi-interconnect bridge (emib) and methods of making such packages. embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. in an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. a bridge substrate is in the cavity and is supported by the first surface of the first layer. embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. in an embodiment the first die is electrically coupled to the second die by the bridge substrate.