Intel corporation (20240234303). INTEGRATED INDUCTOR OVER TRANSISTOR LAYER simplified abstract
Contents
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
Organization Name
Inventor(s)
Telesphor Kamgaing of Chandler AZ (US)
Chee Kheong Yoon of Beyan Lepas (MY)
Chu Aun Lim of Hillsboro OR (US)
Jooi Wah Wong of Bukit Mertajam (MY)
Kavitha Nagarajan of Bangalore KA (IN)
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234303 titled 'INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
- Simplified Explanation:**
The patent application describes integrated circuit devices with semiconductor devices positioned in the center, integrated inductors formed over the semiconductor devices, and power delivery on the opposite side of the semiconductor devices.
- Key Features and Innovation:**
- Semiconductor devices positioned near the center of the device.
- Integrated inductors formed over the semiconductor devices.
- Power delivery on the opposite side of the semiconductor devices.
- Integrated inductors used for power step-down to reduce device thickness and number of power rails.
- Potential Applications:**
This technology can be applied in various integrated circuit devices, power management systems, and electronic devices requiring efficient power delivery and reduced thickness.
- Problems Solved:**
The technology addresses the need for more compact and efficient power delivery systems in integrated circuit devices, as well as the demand for thinner devices with fewer power rails.
- Benefits:**
- Enhanced power management efficiency.
- Reduced device thickness.
- Simplified power delivery systems.
- Improved overall performance of electronic devices.
- Commercial Applications:**
Potential commercial applications include mobile devices, IoT devices, wearables, and other consumer electronics that require compact and efficient power management solutions.
- Questions about Integrated Circuit Devices with Integrated Inductors:**
1. How does the positioning of semiconductor devices near the center of the device impact overall performance? 2. What are the potential cost-saving benefits of using integrated inductors for power step-down in electronic devices?
Original Abstract Submitted
described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device, and integrated inductors formed over the semiconductor devices. power delivery to the device is on the opposite side of the semiconductor devices. the integrated inductors may be used for power step-down to reduce device thickness and/or a number of power rails.
