Intel corporation (20240234283). ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE simplified abstract

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ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

Organization Name

intel corporation

Inventor(s)

Bok Eng Cheah of Gelugor (MY)

Seok Ling Lim of Kulim Kedah (MY)

Jenny Shio Yin Ong of Bayan Lepas (MY)

Jackson Chung Peng Kong of Tanjung Tokong (MY)

Kooi Chi Ooi of Gelugor (MY)

ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240234283 titled 'ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE

The abstract describes a device with a package substrate containing at least one opening and an interconnect structure with a first segment extending under the package substrate and beyond its footprint, and a second segment extending vertically from the first segment through the opening.

  • The device includes a package substrate with openings and an interconnect structure with two segments.
  • The first segment extends under the package substrate and beyond its footprint.
  • The second segment extends vertically from the first segment through the openings in the package substrate.

Potential Applications:

  • This technology could be used in electronic devices where compact interconnect structures are needed.
  • It may find applications in miniaturized sensors or communication devices.

Problems Solved:

  • Enables the creation of compact and efficient interconnect structures.
  • Facilitates the integration of components in small electronic devices.

Benefits:

  • Improved space utilization within electronic devices.
  • Enhanced reliability and performance of interconnects.

Commercial Applications:

  • This technology could be valuable in the development of small consumer electronics such as wearables or IoT devices.
  • It may also have applications in the medical device industry for compact and reliable sensor integration.

Questions about the Technology: 1. How does this interconnect structure compare to traditional methods in terms of efficiency and reliability? 2. What are the potential challenges in manufacturing devices with such intricate interconnect structures?


Original Abstract Submitted

a device is provided, including a package substrate including at least one opening extending through the package substrate, and an interconnect structure including a first segment and a second segment. the first segment may extend under a bottom surface of the package substrate and may further extend beyond a footprint of the package substrate. the second segment may extend vertically from the first segment and may extend at least partially through the at least one opening of the package substrate.

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