Intel corporation (20240230516). WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract
Contents
WAFER-LEVEL BOND STRENGTH MEASUREMENT
Organization Name
Inventor(s)
Khaled Ahmed of San Jose CA (US)
WAFER-LEVEL BOND STRENGTH MEASUREMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240230516 titled 'WAFER-LEVEL BOND STRENGTH MEASUREMENT
Simplified Explanation: The patent application describes a device for measuring bond strength, which includes a plate with a sticky probe and a mirror, along with an optical fiber sensor assembly.
- The device consists of a plate with three portions: one connected to a movement mechanism, one with a sticky probe, and one with a mirror.
- An optical fiber sensor assembly is included, with an optical fiber bundle for sending and receiving light through the fibers.
- The mirror on the plate has a reflective side facing outwards, allowing light to be reflected back to the sensor assembly.
Key Features and Innovation:
- Device for measuring bond strength
- Plate with sticky probe and mirror
- Optical fiber sensor assembly for light transmission and reflection
Potential Applications:
- Quality control in manufacturing processes
- Material testing in research and development
- Structural integrity assessment in construction
Problems Solved:
- Accurate measurement of bond strength
- Non-destructive testing method
- Real-time monitoring of adhesive properties
Benefits:
- Improved quality control
- Enhanced product reliability
- Cost-effective testing solution
Commercial Applications: "Advanced Bond Strength Measurement Device: Revolutionizing Quality Control and Testing in Various Industries"
Prior Art: Readers can explore prior art related to bond strength measurement devices in the field of materials science and engineering.
Frequently Updated Research: Stay updated on the latest advancements in bond strength measurement techniques and technologies.
Questions about Bond Strength Measurement: 1. What are the different methods used for measuring bond strength in industrial applications? 2. How does the use of optical fiber sensor assemblies improve the accuracy of bond strength measurements?
Original Abstract Submitted
this disclosure describes systems, methods, and devices related to bond strength measurement. a device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. the device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
