Intel corporation (20240222350). OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES simplified abstract
Contents
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES
Organization Name
Inventor(s)
Russell K. Mortensen of Chandler AZ (US)
Robert M. Nickerson of Chandler AZ (US)
Nicholas R. Watts of Phoenix AZ (US)
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240222350 titled 'OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES
The abstract describes an offset interposer with a land-side ball-grid array (BGA) and a package-on-package (PoP) side with a PoP-side BGA. The interposer connects two adjacent, spaced-apart land-side pads to two adjacent, spaced-apart PoP-side pads, allowing the land-side BGA to interface with a first-level interconnect and the PoP-side BGA to interface with a PoP substrate. Each land-side pad has a different footprint than the respective PoP-side pads.
- The offset interposer connects land-side and PoP-side BGAs with different pad footprints.
- The interposer enables the land-side BGA to interface with a first-level interconnect and the PoP-side BGA to interface with a PoP substrate.
- The design allows for efficient stacking of packages in a compact space.
- The offset interposer enhances connectivity and functionality in multi-chip module configurations.
- This innovation improves overall system performance and reliability.
Potential Applications: - Multi-chip module configurations - High-density electronic packaging - Mobile devices and wearables - Internet of Things (IoT) devices - Automotive electronics
Problems Solved: - Efficiently connecting different pad footprints in stacked packages - Enhancing connectivity and functionality in compact electronic devices - Improving system performance and reliability in multi-chip configurations
Benefits: - Increased packaging density - Enhanced system performance - Improved reliability and connectivity - Compact design for space-constrained applications - Versatile compatibility with various electronic devices
Commercial Applications: Title: "Innovative Offset Interposer for Enhanced Electronic Packaging" This technology can be utilized in various industries such as consumer electronics, telecommunications, automotive, and IoT for compact, high-performance electronic devices. The offset interposer offers a solution for efficient connectivity and stacking of packages in a space-saving design, catering to the demand for smaller and more powerful electronic products.
Questions about Offset Interposer Technology: 1. How does the offset interposer improve connectivity in multi-chip module configurations? - The offset interposer connects land-side and PoP-side BGAs with different pad footprints, enabling efficient stacking of packages and enhancing overall system performance. 2. What are the potential applications of the offset interposer technology in the automotive industry? - The offset interposer can be used in automotive electronics for compact, high-density packaging solutions, improving system reliability and performance.
Original Abstract Submitted
an offset interposer includes a land side including land-side ball-grid array (bga) and a package-on-package (pop) side including a pop-side bga. the land-side bga includes two adjacent, spaced-apart land-side pads, and the pop-side bga includes two adjacent, spaced-apart pop-side pads that are coupled to the respective two land-side bga pads through the offset interposer. the land-side bga is configured to interface with a first-level interconnect. the pop-side bga is configured to interface with a pop substrate. each of the two land-side pads has a different footprint than the respective two pop-side pads.
