Intel corporation (20240222345). DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING simplified abstract

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Kyle Arrington of Gilbert AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

Kristof Darmawikarta of Chandler AZ (US)

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222345 titled 'DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

The patent application describes an apparatus with multiple interconnect layers within a substrate, organic dielectric material, copper pads, and integrated circuit devices bonded with copper pads.

• The apparatus includes a layer of organic dielectric material covering the interconnect layers.
• Copper pads are embedded within the organic dielectric material.
• A first integrated circuit device is copper-to-copper bonded with the copper pads.
• Inorganic dielectric material is placed over the organic dielectric material, embedding the first integrated circuit device.
• The inorganic dielectric material extends across the width of the substrate.
• A second integrated circuit device is coupled with a substrate surface above the inorganic dielectric material.

Potential Applications: - This technology can be used in the manufacturing of advanced electronic devices. - It can be applied in the development of high-performance integrated circuits.

Problems Solved: - Provides a reliable and efficient method for bonding integrated circuit devices. - Enhances the overall performance and durability of electronic components.

Benefits: - Improved reliability and performance of integrated circuits. - Enhanced functionality of electronic devices. - Increased efficiency in electronic manufacturing processes.

Commercial Applications: Title: Advanced Electronic Manufacturing Technology This technology can be utilized in the production of smartphones, tablets, computers, and other electronic devices. It can also benefit industries involved in semiconductor manufacturing and integrated circuit production.

Questions about the technology: 1. How does this technology improve the reliability of integrated circuits? 2. What are the potential cost savings associated with implementing this technology in electronic manufacturing processes?

Frequently Updated Research: Stay updated on the latest advancements in integrated circuit bonding techniques and materials to enhance the performance and efficiency of electronic devices.

Original Abstract Submitted

an apparatus is provided which comprises: a plurality of interconnect layers within a substrate, a layer of organic dielectric material over the plurality of interconnect layers, copper pads within the layer of organic dielectric material, a first integrated circuit device copper-to-copper bonded with the copper pads, inorganic dielectric material over the layer of organic dielectric material, the inorganic dielectric material embedding the first integrated circuit device, and the inorganic dielectric material extending across a width of the substrate, and a second integrated circuit device coupled with a substrate surface above the inorganic dielectric material. other embodiments are also disclosed and claimed.