Intel corporation (20240222304). METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES simplified abstract

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES

Organization Name

intel corporation

Inventor(s)

Bohan Shan of Chandler AZ (US)

Jiaqi Wu of Chandler AZ (US)

Haobo Chen of Chandler AZ (US)

Srinivas Pietambaram of Chandler AZ (US)

Bai Nie of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Kyle Arrington of Gilbert AZ (US)

Ziyin Lin of Chandler AZ (US)

Hongxia Feng of Chandler AZ (US)

Yiqun Bai of Chandler AZ (US)

Xiaoying Guo of Chandler AZ (US)

Dingying Xu of Chandler AZ (US)

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240222304 titled 'METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SUBSTRATES

Simplified Explanation: The patent application describes methods and apparatus to reduce solder bump bridging between two substrates by controlling the volume of solder used in the bumping process.

Key Features and Innovation:

• Apparatus includes two substrates with multiple bumps on each, electrically coupled by solder.
• Volume of solder used in each bump is controlled to prevent bridging between the substrates.
• First solder volume is less than the second solder volume to ensure proper electrical coupling.

Potential Applications: This technology can be applied in various electronic devices where precise soldering is required, such as microelectronics, circuit boards, and semiconductor packaging.

Problems Solved: The technology addresses the issue of solder bump bridging, which can lead to electrical shorts and malfunction in electronic devices.

Benefits:

• Improved reliability and performance of electronic devices.
• Cost-effective manufacturing process.
• Enhanced electrical connectivity between substrates.

Commercial Applications: Potential commercial applications include the production of smartphones, tablets, laptops, and other electronic devices that require precise soldering techniques for optimal performance.

Prior Art: Readers can explore prior research on solder bumping techniques, solder volume control, and methods to prevent solder bridging in electronic packaging.

Frequently Updated Research: Stay updated on advancements in soldering technologies, volume control techniques, and innovations in electronic packaging to enhance the efficiency and reliability of electronic devices.

Questions about Solder Bump Bridging: 1. What are the common causes of solder bump bridging in electronic devices?

  - Solder bump bridging can occur due to excessive solder volume, improper alignment of substrates, or inadequate control during the soldering process.

2. How does controlling the volume of solder in bumping processes help prevent bridging between substrates?

  - By carefully managing the amount of solder used in each bump, the risk of solder bridging is minimized, ensuring proper electrical coupling between the substrates.

Original Abstract Submitted

methods and apparatus to reduce solder bump bridging between two substrates. an apparatus includes a first substrate including a first bump and a second bump spaced apart from the first bump, the first bump including a first base, the second bump including a second base; and a second substrate including a third bump and a fourth bump spaced apart from the third bump, the third bump including a third base, the fourth bump including a fourth base, the first base electrically coupled to the third base by first solder, the second base electrically coupled to the fourth base by second solder, the first solder having a first volume, the second solder having a second volume, the first volume less than the second volume.